Semiconductor laser apparatus and method for mounting semiconductor laser apparatus
View Patent ↗According to an aspect of the present invention, there is provided a semiconductor laser apparatus including: a laser device including: a semiconductor substrate, first and second resonators formed on the semiconductor substrate, and first and second electrodes that are respectively connected with the first and the second resonators and extend away from each other; and a submount including: third and fourth electrodes respectively adhered with the first and the second electrodes; wherein each of the first and the second electrodes includes: an energizing portion covering the corresponding resonator, an adhering portion being disposed separately from the energizing portion and having a height larger than that of the energizing portion, and a stress-absorbing portion formed in the adhering portion.
1. A semiconductor laser apparatus comprising:
a laser device including:
a semiconductor substrate,
first and second resonators that are formed on the semiconductor substrate, extend in parallel with each other and are electrically separated from each other, and
first and second electrodes that are each electrically connected with corresponding one of the first and the second resonators and extend away from each other; and
a submount including:
third and fourth electrodes that are electrically separated from each other and are each adhered with corresponding one of the first and the second electrodes by a solder member;
wherein each of the first and the second electrodes includes:
an energizing portion that covers corresponding one of the first and the second resonators,
an adhering portion that is disposed separately from the energizing portion, the adhering portion having a height from a surface of the semiconductor substrate larger than that of the energizing portion, and
a stress-absorbing portion that is formed in the adhering portion.
2. The semiconductor laser apparatus according to claim 1 ,
wherein the laser device further includes an n-type cladding layer, an active layer, and a p-type cladding layer that are mounted on the semiconductor substrate.
3. The semiconductor laser apparatus according to claim 1 ,
wherein each of the first and the second resonators includes a stripe waveguide laser resonator.
4. The semiconductor laser apparatus according to claim 1 ,
wherein the first and the second resonators are spaced at a predetermined distance.
5. The semiconductor laser apparatus according to claim 1 ,
wherein the third electrode is adhered with the first electrode through the adhering portion thereof; and
wherein the fourth electrode is adhered with the second electrode through the adhering portion thereof.
6. The semiconductor laser apparatus according to claim 1 ,
wherein the stress-absorbing portion includes a cavity.
7. The semiconductor laser apparatus according to claim 1 ,
wherein the stress-absorbing portion includes an In-member.
8. The semiconductor laser apparatus according to claim 1 ,
wherein the stress-absorbing portion includes a member having a yielding limit stress higher than 0 MPa and at or lower than 5 MPa.
9. The semiconductor laser apparatus according to claim 1 ,
wherein the stress-absorbing portion relaxes a stress generated between the laser device and the submount caused by a thermal expansion coefficient difference therebetween when adhered.
10. The semiconductor laser apparatus according to claim 1 ,
wherein surfaces of the energizing portions are separated from a surface of the submount.
11. The semiconductor laser apparatus according to claim 1 ,
wherein the laser device includes a plurality of resonators disposed at a spacing from each other.
12. A method for mounting a semiconductor laser apparatus, comprising:
preparing a laser device including:
a semiconductor substrate,
first and second resonators that are formed on the semiconductor substrate, extend in parallel with each other and are electrically separated from each other, and
first and second electrodes that are each electrically connected with corresponding one of the first and the second resonators and extend away from each other;
preparing a submount including:
third and fourth electrodes that are electrically separated from each other; and
adhering the first electrode to the third electrode and the second electrode to the fourth electrode by a solder member;
wherein each of the first and the second electrodes includes:
an energizing portion that covers corresponding one of the first and the second resonators,
an adhering portion that is disposed separately from the energizing portion, the adhering portion having a height from a surface of the semiconductor substrate larger than that of the energizing portion, and
a stress-absorbing portion that is formed in the adhering portion.