Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
View Patent ↗An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.
1. A lead frame, comprising:
a body portion; and
a plurality of members extending from said body portion, each of said members having a proximal end and a distal end, said proximal end having a first thickness, said distal end being undulated such that said distal end has an effective thickness greater than said first thickness, said distal end defining opposed surfaces for simultaneously bridging facing contact surfaces which are separated by a dimension greater than said first thickness.
2. The lead frame of claim 1 , wherein said distal end is offset formed.
3. The lead frame of claim 1 , wherein said distal end is corrugated formed.
4. The lead frame of claim 1 , wherein each of said members is bent at an angle of approximately 90° such that said distal ends of said members extend in a direction substantially perpendicular to said body.
5. The lead frame of claim 1 , wherein said plurality of members define a plane, each of said members being nonlinear in a direction within said plane.