Optical storage medium and method of producing optical storage medium
View Patent ↗An optical storage medium has a substrate and a cover layer that allows light to pass therethrough in recording or reproduction. Provided between the substrate and the cover layer are at least a reflective film, a first dielectric film, a recording film, and a second dielectric film formed in this order from the substrate side. Provided further between the second dielectric film and the cover layer is a damp-proof film that is at least partially an amorphous film and contains at least an indium oxide.
1. An optical storage medium comprising:
a substrate;
a cover layer that allows light to pass therethrough in recording or reproduction;
at least a reflective film, a first dielectric film, a recording film, and a second dielectric film formed in this order from the substrate side and between the substrate and the cover layer; and
a damp-proof film provided between the second dielectric film and the cover layer, the damp-proof film being at least partially an amorphous film and containing at least an indium oxide.
2. The optical storage medium according to claim 1 , wherein the damp-proof film contains at least one compound selected from the group consisting of a tin oxide, a tungsten oxide, and a cerium oxide.
3. The optical storage medium according to claim 1 , wherein the damp-proof film contains a tin oxide at 20 mol % or higher but lower than 80 mol %.
4. The optical storage medium according to claim 1 , wherein the cover layer is made of a highly-viscous ultraviolet curable resin.
5. The optical storage medium according to claim 1 further comprising a protective film between the second dielectric film and the cover layer in which the damp-proof film is provided between the second dielectric film and the protective film.
6. A method of producing an optical storage medium comprising the steps of:
forming at least a reflective film, a first dielectric film, a recording film, and a second dielectric film in this order on a substrate by sputtering; and
forming a damp-proof film on the second dielectric film by sputtering with a target of an indium oxide added with at least one compound selected from the group consisting of a tin oxide, a tungsten oxide, and a cerium oxide; and
providing a cover layer over the damp-proof film.
7. The method according to claim 6 further comprising the step of forming a protective film on the damp-proof film and between the damp-proof film and the cover layer by spin coating.
8. The method according to claim 6 , wherein the step of providing the cover layer includes the step of forming a resin layer on the damp-proof film as the cover layer by spin coating.
9. The method according to claim 6 further comprising the steps of:
forming a protective film of a ultraviolet curable resin on the damp-proof film, wherein the cover layer is provided on the protective film; and
exposing the protective film to ultraviolet rays via the cover layer to cure the protective film, thus the cover layer is fixed on the protective film.