Etching apparatus
View Patent ↗An etching apparatus includes: an etching chamber; a piping unit disposed in an upper portion of the etching chamber and including a plurality of nozzles via which an etchant is sprayed; a substrate mask disposed below the piping unit; and a transfer unit disposed below the substrate mask and used to transfer a substrate. The substrate mask interposed between the piping unit including the nozzles and the substrate has a mesh structure or a plurality of holes or slits. Thus, the generation of microbubbles can be prevented during a wet etching process so that a thin layer formed on the substrate can be etched at a uniform etch rate. Also, a lift unit having a fixing unit may be disposed on a lateral surface of the substrate mask. The lift unit moves the substrate mask up and down so as to obtain a uniform etch rate.
1. An etching apparatus comprising:
an etching chamber having upper and lower portions;
a piping unit arranged in the upper portion of the etching chamber and including a plurality of nozzles to spray an etchant;
a substrate mask arranged below the piping unit;
a lift unit arranged on a lateral surface of the substrate mask and supporting the substrate mask with a fixing unit; and
a transfer unit arranged below the substrate mask to transfer a substrate; wherein
the substrate mask comprises a plurality of either holes or slits and is formed of either polyvinyl chloride (PVC) or polytetrafluoroethylene (PTFE).
2. The etching apparatus according to claim 1 , wherein the substrate mask comprises mesh structure.
3. The etching apparatus according to claim 1 , wherein the substrate mask comprises a plurality of sub-substrate masks stacked apart from one another.
4. The etching apparatus according to claim 1 , wherein the lift unit moves the substrate mask up and down.
5. An etching apparatus comprising:
an etching chamber having upper and lower portions;
a piping unit arranged in the upper portion of the etching chamber and including a plurality of nozzles to spray an etchant;
a substrate mask arranged below the piping unit;
a lift unit arranged on a lateral surface of the substrate mask and disposed on inside of the etching chamber;
a fixing unit disposed between the lift unit and the lateral surface of the substrate mask supporting the substrate mask; and
a transfer unit arranged below the substrate mask to transfer a substrate.