Micro-lens fabricated from semiconductor wafer
A purpose of the present invention is to provide a micro-lens enabling in a simple and highly accurate manner to assess an amount of misalignment with an optical axis generated by an error in a process of manufacturing a micro-lens. According to the present invention, the micro-lens manufactured using a semiconductor lens is provided with a lens portion, a peripheral portion located outside the lens portion and a mark for assessment formed near the peripheral portion during a process of manufacturing the lens portion.
1 . A micro-lens manufactured using a semiconductor substrate, provided with
a lens portion;
a peripheral portion located outside the lens portion and
a mark for assessment formed near the peripheral portion during a process to form the lens portion.
2 . The micro-lens according to claim 1 , wherein
the mark is provided so as to contact with the peripheral portion, when said peripheral portion is located inside (smaller than) or outside (larger than) a permissible range (dimensional tolerance).
3 . The micro-lens according to claim 1 , wherein
the mark corresponds to a permissible range (dimensional tolerance) for the location of the peripheral portion and is provided so that the peripheral portion contacts said mark when the peripheral portion is inside the permissible range (dimensional tolerance).
4 . The micro-lens according to claim 1 , wherein
the mark is composed of a pair of mark elements formed at a predetermined interval and the interval of a pair of these mark elements corresponds to a permissible range (dimensional tolerance) for the location of the peripheral portion and,
wherein the pair of mark elements are provided so as to locate therebetween when the peripheral portion is inside the permissible range (dimensional tolerance).
5 . The micro-lens according to claim 1 , wherein
the mark is formed at least in two locations near the peripheral portion.
6 . The micro-lens according to claim 1 , comprising
the feature with forming the said mark along said peripheral portion in a continuously elongated form.
7 . The micro-lens according to claim 1 , wherein
the micro-lens has a configuration to align part of said peripheral portion as a contact when mounted on a semiconductor substrate,
the mark is formed near the location to serve as the contact.
8 . A micro-lens manufactured using a semiconductor substrate, comprising:
a lens portion,
a peripheral portion located outside the lens portion and
a mark for assessment formed near the peripheral portion during a process to form the lens portion, in a micro-lens aligning to mount in a groove with a V-shaped cross-section formed on a semiconductor substrate for an optical module.
9 . The micro-lens according to claim 8 , wherein
the mark is provided so as to contact the peripheral portion, when the location of said peripheral portion is located inside (smaller than) or outside (larger than) a permissible range (dimensional tolerance).
10 . The micro-lens according to claim 8 , wherein
the mark corresponds to a permissible range (dimensional tolerance) for the location of the peripheral portion and is provided so that the peripheral portion contacts said mark when the peripheral portion is inside the permissible range (dimensional tolerance).
11 . The micro-lens according to claim 10 , wherein
the mark is composed of a pair of mark elements formed at a predetermined interval and the interval of a pair of these mark elements corresponds to a permissible range (dimensional tolerance) for the location of the peripheral portion and,
the pair of mark elements are provided so as to locate therebetween when the peripheral portion is inside the permissible range (dimensional tolerance).