Method for making electronic device having metallic connecting structure
View Patent ↗An exemplary method for making an electronic device includes: providing a hot press machine having a press head; placing a bonding film on an inner surface of a metallic housing; turning on the hot press machine and heating the press head to a first predetermined temperature; after heated to the first predetermined temperature, driving the press head to press the bonding film to the metallic housing for about two minutes, thereby attaching the bonding film on the metallic housing; placing the metallic element according to the corresponding bonding film of the metallic housing; heating the press head to a second predetermined temperature; and after heated to the second predetermined temperature, driving the press head to press the at least one metallic element to the metallic housing for at least two minutes, thereby attaching the at least one metallic element on the corresponding bonding film.
1. A method for making an electronic device having a metallic housing, at least one bonding film and at least one metallic element, wherein the at least one metallic element is fixed to an inner surface of the metallic housing via the bonding film, comprising:
providing a hot press machine having a press head;
placing the at least one bonding film on the inner surface of the metallic housing;
heating the press head to a first predetermined temperature of about 40° C. to about 50° C.;
after the first predetermined temperature is reached, driving the press head to press the at least one bonding film to the metallic housing for a first predetermined time, thereby attaching the at least one bonding film on the metallic housing;
placing the at least one metallic element on the at least one bonding film of the metallic housing;
heating the press head to a second predetermined temperature of about 160° C. to about 170° C.;
after the second predetermined temperature is reached, driving the press head to press the at least one metallic element to the metallic housing for second predetermined time, thereby attaching the at least one metallic element on the bonding film.
2. The method of claim 1 , wherein the at least one metallic element is a metallic clip.
3. The method of claim 2 , wherein the metallic clip comprises a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from the base and bending up and outwards.
4. The method of claim 1 , wherein the at least one metallic element is a metallic stud.
5. The method of claim 4 , wherein the metallic housing defines at least one depression, the at least one bonding film adheres to a bottom surface of the at least one depression, and the metallic stud adheres to the at least one bonding film in the at least one depression correspondingly.
6. The method of claim 5 , wherein a depth of the at least one depression is greater than a thickness of the bonding film.
7. The method of claim 1 , wherein the bonding film is a thermoplastic adhesive bonding film.
8. The method of claim 1 , wherein the first predetermined time is about two minutes.
9. The method of claim 1 , wherein the first predetermined time is in a range of at least two minutes.