Arrangement for high frequency application
View Patent ↗A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
1. A power supply arrangement comprising:
a semiconductor package, said semiconductor package including a semiconductor die comprising a power MOSFET having first and second major surfaces, first and second major electrodes comprising a drain electrode and a source electrode respectively each on a respective one of said major surfaces, and a gate electrode disposed on said second major surface, and a cup-shaped metal clip having a flat web portion electrically connected directly to said drain electrode by a layer of conductive adhesive; and
a power supply source comprising a buck converter supplying current to said semiconductor package at a frequency of at least 1 Mhz, wherein thickness of said cup-shaped metal clip is configured to reduce resistance caused by the skin effect to obtain an efficiency of higher than 70% for an output current of 10 Amps or higher.
2. The arrangement of claim 1 , wherein said metal clip is comprised of copper.
3. The arrangement of claim 1 , wherein said metal clip is plated with silver.
4. The arrangement of claim 1 , wherein said thickness of said metal clip is at least four skins deep.
5. The arrangement of claim 1 , wherein said thickness of said metal clip is at least four skins deep but no more than ten skins deep.
6. The arrangement of claim 1 , wherein said cup-shaped metal clip includes two rows of projections at opposing edges of said clip.
7. The arrangement of claim 1 , wherein said cup-shaped metal clip includes a projection at a respective edge of said clip.
8. The arrangement of claim 1 , further comprising a polymeric ring disposed around said die.
9. The arrangement of claim 8 , wherein said polymeric ring comprises an epoxy.
10. The arrangement of claim 1 , further comprising a passivation body on said die, said passivation body acting as a solder resist when said package is mounted on a circuit board.
11. The arrangement of claim 1 , wherein said efficiency is less than or equal to 84%.
12. The arrangement of claim 1 , wherein said output current is less than or equal 100 Amps.
13. The arrangement of claim 1 , wherein said power supply source is a multi-phase buck converter.