Granted Patent B2

US 8,913,527 · App. 12/157,918 · Granted Dec 16, 2014

Abstract

Claims (42)

1. A method, comprising:

operatively connecting a first suitably arranged circuit and a second suitably arranged circuit located on a die surface via a physical link;

configuring said physical link for full-duplex operation,

configuring said first suitably arranged circuit and said second suitably arranged circuit to provide peer-to-peer connection and operation;

accessing resources located on one of said first and second suitably arranged circuits by the other of said first and second suitably arranged circuits and accessing resources located on the other of said first and second suitably arranged circuits by the one of said first and second suitably arranged circuits; and

transferring data information content between said operatively connected first suitably arranged circuit and said second suitably arranged circuit via said full-duplex physical link,

wherein said full-duplex physical link is arranged and configured as a fragmented data interconnect physical link wherein said data information content comprises fragmented data packets arranged and configured for transfer in a one direction link from a first of said first or second suitably arranged and configured circuits for receiving in the other of said first or second suitably arranged and configured circuits, and wherein said data information content comprises fragmented data packets arranged and configured for transfer in a second one direction link in a direction opposite from said first one direction link from the second of said first or second suitably arranged and configured circuits for receiving in the other of said first or second suitably arranged and configured circuits.

2. The method according to claim 1 further comprising locating said first suitably arranged circuit and said second suitably arranged circuit on the surface of the same die.

3. The method according to claim 1 further comprising locating said first suitably arranged circuit on the surface of a first die and locating said second suitably arranged circuit on the surface of a second die.

4. The method according to claim 1 wherein the data information content is configured as fragmented data for transfer between the operatively connected first and second suitably arranged circuits in a self-contained data packet structure.

5. The method according to claim 4 further configuring said self-contained data packet structure for identifying suitable information for on-chip interconnect implementation initiatives and on-chip interconnect implementation responses.

6. The method according to claim 3 further comprising providing via said full-duplex physical link off-die interconnect accesses between a respective one or more first suitably arranged circuits located on said first die and a respective one or more second suitably arranged circuits located on said second die.

7. The method according to claim 6 further comprising transferring data information content in one direction only from said first die to said second die and in the opposite direction only from said second die to said first die.

8. A device, comprising:

a first suitably arranged and configured circuit located on a die surface;

a second suitably arranged and configured circuit located on a die surface;

said first suitably arranged and configured circuit and said second suitably arranged and configured circuit further are configured to provide peer-to-peer connection and operation; and

a full-duplex physical link arranged and configured for operatively connecting said first suitably arranged and configured circuit located on said die surface to said second suitably arranged and configured circuit located on said die surface for transferring data information content between said first suitably arranged and configured circuit and said second suitably arranged and configured circuit, and one of said first or second suitably arranged and configured circuits accesses resources located on the other of said first or second suitably arranged and configured circuits,

wherein said full-duplex physical link is arranged and configured as a fragmented data interconnect physical link wherein said data information content comprises fragmented data packets arranged and configured for transfer in a one direction link from a first of said first or second suitably arranged and configured circuits for receiving in the other of said first or second suitably arranged and configured circuits, and wherein said data information content comprises fragmented data packets arranged and configured for transfer in a second one direction link in a direction opposite from said first one direction link from the second of said first or second suitably arranged and configured circuits for receiving in the other of said first or second suitably arranged and configured circuits.

9. The device according to claim 8 wherein said first suitably arranged and configured circuit is located on a first die surface and said second suitably arranged and configured circuit is located on a second die surface.

10. The device according to claim 9 wherein said first die surface and said second die surface comprise a surface of a single die.

11. The device according to claim 9 wherein at least one of said first suitably arranged and configured circuit or said second suitably arranged and configured circuit comprises a microprocessor.

12. The device according to claim 11 further comprising:

said first suitably arranged and configured circuit comprising an on-chip interconnect implementation, and

said second suitably arranged and configured circuit comprising an on-chip interconnect implementation.

13. The device according to claim 12 further comprising:

said first suitably arranged and configured circuit further comprising a first data transmitter and a first data receiver, and

said second suitably arranged and configured circuit further comprising a second data transmitter and a second data receiver.

14. The device according to claim 13 wherein said first data transmitter and said second data transmitter are arranged and configured for forming self-contained data packets.

15. The device according to claim 14 wherein said self-contained data packets are further arranged and configured as fragmented data packets.

16. The device according to claim 15 comprising said first data receiver and said second data receiver are further arranged and configured for receiving said fragmented data packets.

17. A device, comprising:

a first die comprising microprocessor controlled cellular modem logic;

a second die comprising an evolved universal terrestrial radio access network hardware accelerator;

a physical link arranged and configured for full duplex operation as a die input/output interface for connecting said first die to said second die such that said microprocessor is enabled with off-die access to and from said second die, said microprocessor controlled cellular modem logic on said first die accessing resources of said evolved universal terrestrial radio access network hardware accelerator located on said second die, and said evolved universal terrestrial radio access network hardware accelerator located on said second die accessing resources of said microprocessor controlled cellular modem logic located on said first die, said microprocessor controlled cellular modem logic and said evolved universal terrestrial radio access network hardware accelerator further configured to provide peer-to-peer connection and operation,

wherein said full-duplex physical link is arranged and configured as a fragmented data interconnect physical link wherein data information content transferred between said first die and said second die comprises fragmented data packets arranged and configured for transfer in a one direction link from a first of said first or second dies for receiving in the other of said first or second dies, and wherein said data information content comprises fragmented data packets arranged and configured for transfer in a second one direction link in a direction opposite from said first one direction link from the second of said first or second dies for receiving in the other of said first or second dies.

18. A device, comprising:

one or more modules arranged and configured to operatively connect first and second suitably arranged circuits located on a die surface via a physical link, said first and second suitably arranged circuit further configured to provide peer-to-peer connection and operation wherein one of said first and second suitably arranged and configured circuits is configured to access resources located on the other of said first and second suitably arranged circuits and the other of said first and second suitably arranged and configured circuit is configured to access resources located on the one of said first and second suitably arranged and configured circuits;

one or more modules arranged and configured to configure the physical link for full-duplex operation, and

one or more modules arranged and configured to transfer data information content between the first and second suitably arranged circuits via the full-duplex physical link,

wherein said full-duplex physical link is arranged and configured as a fragmented data interconnect physical link wherein said data information content comprises fragmented data packets arranged and configured for transfer in a one direction link from a first of said first or second suitably arranged and configured circuits for receiving in the other of said first or second suitably arranged and configured circuits, and wherein said data information content comprises fragmented data packets arranged and configured for transfer in a second one direction link in a direction opposite from said first one direction link from the second of said first or second suitably arranged and configured circuits for receiving in the other of said first or second suitably arranged and configured circuits.

19. The device according to claim 18 further comprising a mobile communication device.

Assignments (10)