SEMICONDUCTOR TEST EQUIPMENT
A test head ( 3 ) has test electrodes ( 5 ) for electrical connection between a test unit ( 4 ) and interface board terminals ( 6 ). The state of electrical connection of the test electrodes ( 5 ) to the interface board terminals ( 6 ) is arbitrarily controlled using respective movable parts of the test electrodes ( 5 ), whereby the state of electrical connection between the test unit ( 4 ) and the interface board terminals ( 6 ) is changed.
1 . (canceled)
2 . Semiconductor test equipment comprising:
a test head having a plurality of test electrodes commonly connected to one test unit; and
an interface board having a plurality of board terminals individually connected to a plurality of device terminals of a device under test,
wherein each of the plurality of test electrodes has a movable part so as to come in contact with a corresponding one of the plurality of board terminals and establish an electric connection such that a selective connection path is formed between the test unit and the plurality of device terminals, and
the movable parts of each of the plurality of test electrodes are concentrically arranged.
3 . The semiconductor test equipment of claim 2 , wherein the interface board has a multilayered structure adapted to the movable parts of each of the plurality of test electrodes.
4 . (canceled)
5 . Semiconductor test equipment comprising:
a test head having a plurality of test electrodes individually connected to a plurality of test units; and
an interface board having a board terminal electrically connected to one device terminal of a device under test,
wherein each of the plurality of test electrodes has a movable part so as to come in contact with the board terminal and establish an electric connection such that a selective connection path is formed between the plurality of test units and the device terminal, and
the movable parts of each of the plurality of test electrodes are concentrically arranged.
6 . The semiconductor test equipment of claim 5 , wherein the interface board has a multilayered structure adapted to the movable parts of each of the plurality of test electrodes.