IP Library Granted Patent US 7,888,671
Granted Patent B2
US 7,888,671 · App. 12/159,485 · Granted Feb 15, 2011

Semiconductor device

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Quick Facts
Patent No.
US 7,888,671
App. No.
12/159,485
Granted
Feb 15, 2011
Kind
B2
Abstract

Provided is a semiconductor device comprising an organic semiconductor element A and an organic semiconductor element B, wherein the organic semiconductor element A has a source electrode and a drain electrode disposed on a surface of a substrate; a channel gap disconnecting the source electrode and the drain electrode; an organic semiconductor layer disposed on the source electrode, the drain electrode and the channel gap; an insulating film disposed on the organic semiconductor layer; a gate electrode disposed on the insulating film; a bank defining the organic semiconductor layer; a and groove through the bank, a distance between the apex of the bank and the surface of a substrate is greater than a distance between the apex of the channel gap and the surface of the substrate, and the organic semiconductor element B has a source electrode or a drain electrode connected with the gate electrode of the organic semiconductor element A via the groove through the bank of the organic semiconductor element A.

Claims (21)

1. Semiconductor device comprising an organic semiconductor element A and an organic semiconductor element B, wherein

the organic semiconductor element A has a source electrode and a drain electrode disposed on a surface of a substrate; a channel gap disconnecting the source electrode and the drain electrode; an organic semiconductor layer disposed on the source electrode, the drain electrode and the channel gap; an insulating film disposed on the organic semiconductor layer; a gate electrode disposed on the insulating film; a bank defining the organic semiconductor layer; and a groove through the bank,

a distance between the apex of the bank and the surface of a substrate is greater than a distance between the apex of the channel gap and the surface of the substrate, and

the organic semiconductor element B has a source electrode or a drain electrode connected with the gate electrode of the organic semiconductor element A via the groove through the bank of the organic semiconductor element A.

2. The semiconductor device according to claim 1 , wherein the gate electrode of the organic semiconductor element A and the source electrode or the drain electrode of the organic semiconductor element B are disposed on a same plane.

3. The semiconductor device according to claim 1 , wherein

the organic semiconductor element B has a gate electrode disposed on the surface of a substrate; an insulating film disposed on the gate electrode; a source electrode and a drain electrode disposed on the insulating film; an organic semiconductor layer disposed on the source electrode and the drain electrode; a bank defining the organic semiconductor layer; and a groove through the bank, which communicates with the groove through the bank of the organic semiconductor element A, and

the gate electrode of the organic semiconductor element A is connected with the source electrode or the drain electrode of organic semiconductor element B via the groove for the communicating.

4. The semiconductor device according to claim 1 , wherein the width of the groove is 3 to 200 μm.

5. An organic EL device comprising the semiconductor device according to claim 1 and an organic luminescent element having a pixel electrode connected to the drain electrode of the organic semiconductor element A.

6. A semiconductor device comprising an organic semiconductor element A and an organic semiconductor element B, wherein

the organic semiconductor element A has a source electrode and a drain electrode disposed on a surface of a substrate; a channel gap disconnecting the source electrode and the drain electrode; an organic semiconductor layer disposed on the source electrode, the drain electrode and the channel gap; an insulating film disposed on the organic semiconductor layer, a gate electrode disposed on the insulating film; a bank defining the organic semiconductor layer, and a hole through the bank,

a distance between the apex of the bank and the surface of the substrate is greater than a distance between the apex of the channel gap and the surface of the substrate,

the organic semiconductor element B, has a gate electrode connected with the source electrode or the drain electrode of the organic semiconductor element A via the hole through the bank of the organic semiconductor element A,

the source electrode or the drain electrode of the organic semiconductor element A and the gate electrode of the organic semiconductor element B are disposed on a plane, and

the hole extends along the plane.

7. The semiconductor device according to claim 6 , wherein

the organic semiconductor element B has a gate electrode disposed on the surface of the substrate; an insulating film disposed on the gate electrode; a source electrode and a drain electrode disposed on the insulating film; an organic semiconductor layer disposed on the source electrode and the drain electrode; a bank defining the organic semiconductor layer, and a hole through the bank, which communicates with the hole through the bank of the organic semiconductor element A, and

the source electrode or the drain electrode of the organic semiconductor element A is connected with the gate electrode of the organic semiconductor element B via the hole for the communicating.

8. The semiconductor device according to claim 6 , wherein the width of the hole is 3 to 200 μm and the height of the hole is 20 to 200 nm.

9. An organic EL device comprising the semiconductor device according to claim 6 and an organic luminescent element having a pixel electrode connected to the drain electrode of the organic semiconductor element B.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2015
From: PANASONIC CORPORATION
To: JOLED INC
Reel/Frame 035187/0483 →
CHANGE OF NAME Recorded Nov 13, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021832/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2008
From: YOSHIDA, HIDEHIRO; NAGAI, HISAO; KITAMURA, YOSHIRO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 021434/0412 →