Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those
View Patent ↗Disclosed is an adamantane derivative which provides a cured product excellent in optical characteristics such as transparency and light resistance, long-term heat resistance, electrical characteristics such as and dielectric constant, and low water absorption. Also disclosed are a resin composition containing the adamantane derivative, a sealing agent for electronic circuits, optical electronic member, semiconductor device and copper-clad laminate all using the resin composition, and a radiation-sensitive resin composition which contains the above-mentioned adamantane derivative as a crosslinking agent. Specifically disclosed are an adamantane derivative represented by the formula (I-1) below, a resin composition containing the adamantane derivative, a sealing agent for electronic circuits, optical electronic member, semiconductor device and copper-clad laminate, all using the resin composition, and a radiation-sensitive resin composition which contains the above-mentioned adamantane derivative as a crosslinking agent.
1. An adamantane compound represented by the following general formula (I-1),
2. An adamantane compound represented by the following general formula (I-3),
3. A method of producing an adamantane compound according to claim 1 , said method comprising allowing an adamantane compound represented by the following general formula (II) to react with epichlorohydrin,
wherein in the formula, a is 1, and b is 0.
4. A resin composition comprising (A) a resin comprising the adamantane compound according to claim 1 and (B) an epoxy resin curing agent.
5. The resin composition according to claim 4 , wherein (B) the epoxy resin curing agent is one or more selected from the group consisting of a cationic polymerization initiator, an acid anhydride compound, and a phenolic resin.
6. The resin composition according to claim 4 , further comprising (C) a curing accelerator and (D) an inorganic filler.
7. The resin composition according to claim 6 , further comprising (E) a flame retardant.
8. A radiation-sensitive resin composition comprising the adamantane compound according to claim 1 as a crosslinking agent.
9. An optical electronic member comprising the adamantane compound according to claim 1 .
10. A sealing agent for an electronic circuit comprising the adamantane compound according to claim 1 .
11. A semiconductor device wherein a semiconductor element is sealed with the resin composition according to claim 4 .
12. A copper-clad laminate comprising the resin composition according to claim 4 .
13. The adamantine compound according to claim 2 having a glass transition temperature of 219° C.