Connecting portion of circuit board and circuit board-connecting structure technical field
View Patent ↗In a circuit board-connecting portion 10 , a first connecting portion 15 and a second connecting portion 20 are disposed in facing relation such that first conductors 14 contact second conductors 19 , and also a first substrate 12 and a second substrate 17 are fixed to each other by an adhesive 22 . The first connecting portion 15 has rigid members 24 provided at a reverse surface 12 B of the first substrate 12 which is a soft substrate, and the rigid members 24 are disposed along a direction of a thickness of the first substrate 14 , and are provided at positions corresponding to at least parts 14 A of the first conductors 14.
1. A connecting portion of a circuit board that is connected to a circuit pattern formed along a surface of a soft substrate formed into a sheet-like shape, and has a conductor disposed on the substrate, comprising:
a rigid member, provided at a reverse surface of the soft substrate;
wherein the rigid member is disposed along a direction of a thickness of the soft substrate at a position corresponding to at least part of the conductor, the rigid member configured to deform the soft substrate when a force is applied to the rigid member in a direction extending from the reverse surface to the surface.
2. The connecting portion of the circuit board recited in claim 1 , wherein the rigid member is disposed in intersecting relation to the conductor.
3. A circuit board-connecting structure,
in which the structure comprises a first circuit board and a second circuit board each including a circuit pattern formed along a surface of a substrate formed into a sheet-like shape, and a connecting portion connected to the circuit pattern and having a conductor disposed on the substrate, and
in which the connecting portions are disposed in facing relation such that the conductors contact each other, and the substrates are fixed to each other by an adhesive;
wherein the substrate of the first circuit board is a soft substrate and has a rigid member provided at a reverse surface of the substrate; and
the rigid member is disposed along a direction of a thickness of the soft substrate at a position corresponding to at least part of the conductor, the rigid member configured to deform the substrate when a force is applied to the rigid member in a direction extending from the reverse surface to the surface.
4. The circuit board-connecting structure recited in claim 3 , wherein the rigid member is disposed in intersecting relation to the conductor.