IP Library Granted Patent US 8,449,180
Granted Patent B2
US 8,449,180 · App. 12/161,760 · Granted May 28, 2013

Temperature sensor

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Quick Facts
Patent No.
US 8,449,180
App. No.
12/161,760
Granted
May 28, 2013
Kind
B2
Abstract

This invention is to provide a temperature sensor which can measure a precise temperature of a minute region, which can measure a temperature in a wide range from a low temperature to a high temperature, and which has a simple structure. The temperature sensor comprises a two-dimensional electron gas. A resistance of the two-dimensional electron gas is used to measure a temperature. The two-dimensional electron gas may have a heterostructure selected from the group consisting of an AlGaN/GaN system, an AlGaAs/GaAs system, an InAs/GaAs system, an InAs/GaSb/AlSb system, a SiGe/Si system, a SiC/Si system, a CdTe/HgTe/CdTe system, an InGaAs/InAlAs/InP system, and nanocrystalline silicon.

Claims (22)

1. A temperature sensor comprising a two-dimensional electron gas, wherein a resistance of said two-dimensional electron gas is used to measure a temperature, and wherein the temperature sensor is subjected to optical excitation.

2. The temperature sensor according to claim 1 , further comprising a protective film formed on a contact region of said temperature sensor.

3. The temperature sensor according to claim 2 , wherein the protective film comprises silicon nitride (SiN).

4. The temperature sensor according to claim 1 , wherein said two-dimensional electron gas has a heterostructure selected from the group consisting of an AlGaN/GaN system, an AlGaAs/GaAs system, an InAs/GaAs system, an InAs/GaSb/AlSb system, a SiGe/Si system, a SiC/Si system, a CdTe/HgTe/CdTe system, an InGaAs/InAlAs/InP system, and nanocrystalline silicon.

5. The temperature sensor according to claim 1 , wherein said two-dimensional electron gas has a heterostructure of an AlGaN/GaN system, said temperature sensor further comprising a thin barrier layer provided between a supply layer and a smaller band gap layer than said supply layer of said heterostructure.

6. The temperature sensor according to claim 5 , wherein the thin barrier layer comprises aluminum nitride (AIN), and wherein the thin barrier layer has a thickness of between approximately 1 nanometer (nm) and approximately 2 nm.

7. The temperature sensor according to claim 1 , wherein said temperature sensor has a plurality of sensors disposed in a matrix form.

8. The temperature sensor according to claim 1 , wherein said temperature sensor further comprises a magnetic field transducer.

9. The temperature sensor according to claim 1 , wherein the temperature sensor is configured to detect temperatures between absolute zero and 600 degrees Celsius.

10. The temperature sensor according to claim 1 , further comprising:

a substrate; and

a first layer that is adjacent to the substrate.

11. The temperature sensor according to claim 10 , wherein the first layer is deposited onto the substrate by way of crystal growth.

12. The temperature sensor according to claim 10 , wherein the first layer comprises gallium nitride (GaN).

13. The temperature sensor according to claim 10 , further comprising a second layer adjacent to the first layer.

14. The temperature sensor according to claim 13 , wherein the second layer comprises aluminum gallium nitride (AlGaN).

15. The temperature sensor according to claim 14 , wherein the AlGaN comprises n-type AlGaN.

16. The temperature sensor according to claim 13 , wherein the second layer is deposited onto the first layer by way of crystal growth.

17. The temperature sensor according to claim 13 , wherein the two-dimensional electron gas is positioned at an interface between the first layer and the second layer.

18. The temperature sensor according to claim 1 , further comprising one or more ohmic contacts through which the resistance of the two-dimensional electron gas is measured.

19. The temperature sensor according to claim 1 , wherein the two-dimensional electron gas is positioned at a depth of approximately 30 nanometers (nm) from a surface of the temperature sensor.

20. The temperature sensor according to claim 1 , wherein the temperature sensor is incorporated into a probe tip of a scanning probe microscope.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED ON JANUARY 29, 2019 AT REEL 048373 FRAME 0217 Recorded Sep 22, 2025
From: CRESTLINE DIRECT FINANCE, L.P., AS COLLATERAL AGENT
To: EMPIRE TECHNOLOGY DEVELOPMENT LLC
Reel/Frame 072936/0464 →
SECURITY INTEREST Recorded Jan 29, 2019
From: EMPIRE TECHNOLOGY DEVELOPMENT LLC
To: CRESTLINE DIRECT FINANCE, L.P.
Reel/Frame 048373/0217 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2013
From: SANDHU, ADARSH
To: EMPIRE TECHNOLOGY DEVELOPMENT LLC
Reel/Frame 030640/0770 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2008
From: SANDHU, ADARSH; YAMAMURA, TAKUYA; TAODA, MAKOTO; PRIMADANI, ZAKI
To: ADARSH SANDHU
Reel/Frame 021336/0682 →