IP Library Granted Patent US 7,736,543
Granted Patent B2
US 7,736,543 · App. 12/162,335 · Granted Jun 15, 2010

Exothermic polyphenylene sulfide compounds

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Quick Facts
Patent No.
US 7,736,543
App. No.
12/162,335
Granted
Jun 15, 2010
Kind
B2
Abstract

Use of an exothermic additive in a polyphenylene sulfide compound results in an extruded or molded thermoplastic article that is electrically conductive and exothermic when connected to a source of electrical energy. Electronic devices benefit from these articles, particularly where ink must be melted for imaging of commercial graphics on a substrate.

Claims (26)

1. A polyphenylene sulfide composition, comprising:

(a) polyphenylene sulfide,

(b) an exothermic additive, and

(c) high density polyethylene,

wherein the composition is exothermic when connected to a source of electrical energy and wherein both the exothermic additive and the high density polyethylene contribute to a given temperature at a given voltage.

2. The composition of claim 1 , wherein the exothermic additive comprises the combination of two different forms of carbon, and wherein one form is more electrically conductive than the other form.

3. The composition of claim 1 , wherein the exothermic additive is a combination of particles of carbon black and particles of graphite, and wherein particles of carbon black are more electrically conductive than particles of graphite.

4. The composition of claim 2 , wherein the more electrically conductive form of carbon is selected from the group consisting of particles of carbon black, single-walled nanotubes, multi-walled nanotubes, nanofibers, and combinations thereof.

5. The composition of claim 1 , wherein the exothermic additive comprises a form of carbon that has a high aspect ratio and is electrically conductive.

6. The composition of claim 1 , wherein the exothermic additive are particles having a size within the nanometric or micrometric region.

7. The composition of claim 1 , wherein the exothermic additive are particles having an aspect ratio ranging from about 1:1 to about 20,000:1.

8. The composition of claim 2 , wherein the weight ratio of more conductive:less conductive forms of carbon can range from 2.2:1 to about 3:1.

9. The composition of claim 1 , wherein the amount of exothermic additive ranges from about 1 to about 75 weight percent of the composition.

10. The composition of claim 3 , wherein the weight ratio of more conductive:less conductive forms of carbon can range from 2.2:1 to about 3:1.

11. The composition of claim 3 , wherein the amount of exothermic additive ranges from about 1 to about 75 weight percent of the composition.

12. The composition of claim 1 , further comprising optional additives selected from the group consisting of fillers, pigments, colorants, processing lubricants, impact modifiers, uv-stabilizers, processing aids, biocides, and flame retardants, wherein the optional additive is present in an amount ranging from 0 to about 25 weight percent of the composition.

13. A method of making the composition of claim 3 , comprising the steps of:

(a) dry mixing the carbon black particles in a mixer;

(b) adding the polyphenylene sulfide into the mixer and continuing dry mixing;

(c) adding the graphite particles into the mixer and continuing dry mixing step to form a dry blend; and

(d) extruding the dry blend in an extruder.

14. A thermoplastic article, comprising the polyphenylene sulfide composition of claim 1 , wherein the article is exothermic throughout the bulk of the article when the article is connected to a source of electrical energy.

15. An electronic device, comprising a thermoplastic article of claim 14 .

16. The composition of claim 2 , wherein the exothermic additive comprises a form of carbon that has a high aspect ratio and is electrically conductive.

17. The composition of claim 2 , wherein the exothermic additive are particles having a size within the nanometric or micrometric region.

18. The composition of claim 2 , wherein the exothermic additive are particles having an aspect ratio ranging from about 1:1 to about 20,000:1.

Assignments (6)
RELEASE OF SECURITY INTERESTS IN PATENTS RECORDED AT REEL 027522, FRAME 0154. Recorded Jun 24, 2025
From: WELLS FARGO CAPITAL FINANCE, LLC, AS ADMINISTRATIVE AGENT
To: AVIENT CORPORATION (F/K/A POLYONE CORPORATION); GSDI SPECIALTY DISPERSIONS, INC. (F/K/A GAYSON SILICON DISPERSIONS, INC.); THE COLORMATRIX CORPORATION; COLORMATRIX HOLDINGS, INC.
Reel/Frame 071711/0354 →
RELEASE (REEL 027456 / FRAME 0779) Recorded Nov 18, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: POLYONE CORPORATION
Reel/Frame 037129/0199 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL 027450 FRAME 0907 Recorded Feb 28, 2013
From: BANK OF AMERICA, N.A., AS AGENT
To: POLYONE CORPORATION
Reel/Frame 029900/0240 →
SECURITY AGREEMENT Recorded Dec 29, 2011
From: POLYONE CORPORATION
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 027456/0779 →
SECURITY AGREEMENT Recorded Dec 28, 2011
From: POLYONE CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 027450/0907 →
SECURITY AGREEMENT Recorded Dec 23, 2011
From: POLYONE CORPORATION; GAYSON SILICONE DISPERSIONS, INC.; COLORMATRIX CORPORATION, THE; COLORMATRIX HOLDINGS, INC.
To: WELLS FARGO CAPITAL FINANCE, LLC
Reel/Frame 027522/0154 →