Polymer brushes
View Patent ↗Polymer brushes ( 50 ) in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment ( 55 ).
1. A resin comprising: polymer brushes dispersed within said resin, said polymer brushes comprising:
a base structure comprising a substrate, an initiator layer extending from the substrate, and a polymer layer extending from the initiator layer; and
a plurality of liquid crystal thermoset epoxy polymer chains that are attached to and extend from the polymer layer of the base structure, wherein said polymer brushes have a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK;
wherein said polymer brushes are configured to increase an ordering of the polymer chains and resin molecules within the resin, thereby increasing a thermal conductivity of the resin.
2. The resin of claim 1 , wherein said substrate comprises a surface of a particle or a surface of a polymer.
3. The resin of claim 1 , wherein the resin further comprises high thermal conductivity (HTC) filler materials, wherein said HTC filler materials comprise 5-40% by volume of said resin, and wherein said HTC filler materials have aspect ratios of 3-100.
4. The resin of claim 1 , wherein the polymer brushes have a chain length of 2 to 100 nm.
5. The resin of claim 1 , wherein said resin comprises an epoxy resin.
6. The resin of claim 1 , wherein said resin comprises a hydrocarbon.
7. The resin of claim 1 , wherein said resin comprises at least one of a polybutadiene, a polysiloxane, an aromatic polyester, or an aromatic polyamide.
8. The resin of claim 1 , wherein said polymer brushes comprise 10-25% by volume of said resin.
9. An insulating tape comprising the resin of claim 1 .
10. An epoxy resin comprising:
high thermal conductivity (HTC) filler materials that comprise 5-40% by volume of said epoxy resin, wherein said HTC filler materials have aspect ratios of 3-100; and
polymer brushes dispersed within said epoxy resin, wherein said polymer brushes are attached to and extend between adjacent HTC filler materials within said epoxy resin to form bridged HTC filler materials;
wherein said HTC filler materials form a continuous organic-inorganic composite with said epoxy resin and said polymer brushes;
wherein said polymer brushes comprise 10-25% by volume of said epoxy resin; and
wherein said bridged HTC filler materials create phonon channels within said epoxy resin; and
wherein said polymer brushes comprise a plurality of polymer chains having a chain length of 1 to 1000 nm.
11. The epoxy resin of claim 10 , wherein said epoxy resin comprises at least one of liquid crystal thermoset polymers, interpenetrating networks, polymer brush type matrices, expanding polymers, ladder polymers, star polymers or structured organic-inorganic hybrids.
12. The epoxy resin of claim 11 , wherein said HTC filler materials comprise one or more of Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2.
13. The epoxy resin of claim 10 , wherein the polymer chains have a density of 0.8 to 1.0 g/cc and a thermal conductivity of 0.5 to 5.0 W/mK.
14. An insulating tape comprising the epoxy resin of claim 10 .
15. The resin of claim 1 , wherein said substrate comprises at least one of alumina, silica, boron nitride, a polymer, mica, or glass fibers.
16. The resin of claim 1 , wherein the plurality of liquid crystal thermoset epoxy polymer chains extend from a polymer layer comprising an epoxy-vinyl monomer.
17. The resin of claim 1 , wherein resin molecules surrounding said polymer hairs in said resin are oriented in the same direction as said polymer chains.