Display device and manufacturing method therefor
View Patent ↗Disclosed herein is a display device including a pair of substrates opposed to each other, a pixel region provided between the substrates, and an external wiring provided on an extension of one of the substrates. The external wiring is disposed in a recess formed on the extension. With this structure, the external wiring provided on the extension can be reliably protected to thereby improve the reliability of the display device.
1. A display device comprising a pair of substrates opposed to each other, a pixel region provided between said substrates, and a wiring;
said wiring being disposed in a recess formed in a trench that extends through a gate insulating layer and an interlayer insulating layer of the display device and at least partially into a surface of the substrate upon which the insulating layer is formed, wherein the trench is located adjacent to an image generating region of the display, the trench extending in a direction perpendicular to the image generating region, the trench being formed such that a base of the trench is wider than a widest portion of the wiring and a top of the wiring is lower than a top of the interlayer insulating layer within which the trench is formed and higher than a top portion of the substrate within which the trench is formed.
2. A display device according to claim 1 , wherein the depth of said recess is greater than or equal to the height of said wiring.
3. A display device according to claim 1 , further comprising a multilayer thin film formed in the periphery of said recess;
the depth of said recess extending from said multilayer thin film to said substrate.
4. A display device according to claim 1 , further comprising a circuit element;
said recess being formed between said circuit element and a connected portion of said wiring.
5. A manufacturing method for a display device having a pair of substrates opposed to each other, a pixel region formed between said substrates, and a wiring, said manufacturing method comprising:
forming a recess that extends through a gate insulating layer and an interlayer insulating layer of the display device and at least partially into a surface of the substrate upon which the insulating layer is formed; and
disposing said wiring in said recess,
wherein a metal film of the wiring is formed and a barrier metal is formed on an upper surface of the metal film, and wherein the trench is located adjacent to an image generating region of the display, the trench extending in a direction perpendicular to the image generating region, the trench being formed such that a base of the trench is wider than a widest portion of the wiring and a top of the wiring is lower than a top of the interlayer insulating layer within which the trench is formed.
6. A manufacturing method according to claim 5 , further comprising forming through holes in the formation of said pixel region;
said step of forming said recess being the same as said step of forming said through holes.
7. A manufacturing method according to claim 5 , wherein the depth of said recess is greater than or equal to the height of said wiring.
8. A manufacturing method according to claim 5 , wherein said display device further has a multilayer thin film formed in the periphery of said recess;
the depth of said recess extending from said multilayer thin film.
9. A display device according to claim 1 , wherein the substrate is glass.
10. A method of manufacturing a display device according to claim 5 , wherein the substrate is glass.