Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor
The present disclosure relates to a fingerprint sensor device. The device comprises a sensor having a sensitive active region that is electrically connected to a substrate. The device further includes a first resin bump positioned proximate to the sensitive active region. The first resin bump forms a finger guide that positions the finger over the sensitive active region when the finger slides in contact with the first resin bump.
1 . A device, comprising:
a substrate;
a fingerprint sensor having a first side and a second side, the first side attached to the substrate, the fingerprint sensor being electrically connected to the substrate and having a sensitive active region defined on the second side of the fingerprint sensor; and
a first resin bump positioned proximate to the sensitive active region of the fingerprint sensor so that a finger that is in contact with the first resin bump is also in contact with the sensitive active region, the first resin bump forming a finger guide that positions the finger over the sensitive active region when the finger slides in contact with the first resin bump.
2 . The device of claim 1 , wherein the first resin bump has a height of at least 500 microns.
3 . The device of claim 1 , wherein the first resin bump is positioned over a portion of the fingerprint sensor and a portion of the substrate.
4 . The device of claim 1 , wherein a second resin bump is positioned at an opposite end of the fingerprint sensor from the first resin bump.
5 . The device of claim 4 , wherein the second resin bump is positioned over a portion of the fingerprint sensor and a portion of the substrate.
6 . The device of claim 5 , wherein a resin layer covers the sensitive active region to protect the surface of the active region.
7 . The device of claim 1 , wherein the electrical connection comprises wire bonding wire.
8 . The device of claim 7 , wherein the first resin bump covers the entire electrical connection.
9 . The device of claim 1 , wherein the first resin bump has a height that is less than one millimeter from the fingerprint sensor.
10 . A fingerprint sensor, comprising:
an integrated circuit chip having a first side that is longer than a second side;
a substrate including electrical connections;
an electrical wire connecting the second side of the integrated circuit chip to the electrical connections; and
a protective resin that covers a portion of the substrate and a portion of the integrated circuit chip and encapsulates the electrical wire, the protective resin forming a first bump that constitutes a guide for a finger when the finger slides over the integrated circuit chip substantially perpendicular to the first side of the chip.
11 . The fingerprint sensor of claim 10 , wherein the first bump has a height of at least 500 microns.
12 . The fingerprint sensor of claim 10 , wherein the protective resin forms a second bump positioned at an opposite end of the integrated circuit chip from the first bump.
13 . The fingerprint sensor of claim 12 , wherein the second bump is positioned over a portion of the integrated circuit chip and a portion of the substrate.
14 . The fingerprint sensor of claim 13 , wherein a protective resin covers the integrated circuit chip to protect the surface of the integrated circuit chip.
15 . The fingerprint sensor of claim 10 , wherein the electrical wire comprises a wire bonding wire.
16 . The fingerprint sensor of claim 10 , wherein the first bump has a height that is less than one millimeter above the fingerprint sensor.