IP Library Granted Patent US 8,213,131
Granted Patent B2
US 8,213,131 · App. 12/166,126 · Granted Jul 3, 2012

Read sensors with improved orientation of the hard bias layer and having a nanocrystalline seed layer

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Quick Facts
Patent No.
US 8,213,131
App. No.
12/166,126
Granted
Jul 3, 2012
Kind
B2
Abstract

A system in one embodiment includes a magnetic sensor having a free magnetic layer, a nanocrystalline seed layer formed on an insulative amorphous material; a chromium-containing underlayer formed on the seed layer; and a hard bias layer formed on the underlayer and separated from the sensor by the insulative amorphous material. A method according to a further embodiment includes forming an amorphous insulative layer encapsulating a sensor stack; forming a nanocrystalline seed layer on the amorphous insulative material; forming a chromium-containing underlayer on the seed layer; and forming a hard bias layer on the underlayer. Additional systems and methods are presented.

Claims (40)

1. A system, comprising:

a magnetic sensor having a free magnetic layer;

a nanocrystalline seed layer formed on an insulative amorphous material;

a chromium-containing underlayer formed on the seed layer; and

a hard bias layer formed on the underlayer and separated from the sensor by the insulative amorphous material.

2. The system of claim 1 , wherein the magnetic sensor is a current-perpendicular-to-plane (CPP) sensor.

3. The system of claim 1 , wherein the seed layer is MgO.

4. The system of claim 1 , wherein the seed layer is AlN.

5. The system of claim 1 , wherein the underlayer is selected from a group consisting of: Cr and CrX, where X includes at least one of W, Mo, V, and Ti.

6. The system of claim 1 , wherein the hard bias layer is selected from a group consisting of: CoPt and CoPtY, where Y includes at least one of Cr, B, and N.

7. The system of claim 1 , further comprising a cap layer formed above the hard bias layer.

8. A system, comprising:

a current-perpendicular-to-plane (CPP) sensor, comprising a metallic seed layer, a pinning layer, an artificial antiferromagnetic layer, a spacer layer, a free magnetic layer, and a cap layer;

a nanocrystalline seed layer formed along sides of the sensor stack and extending horizontally away therefrom, the seed layer being electrically insulative;

a chromium-containing underlayer preferably epitaxially formed on the nanocrystalline seed layer; and

a hard bias layer preferably epitaxially formed on the underlayer.

9. The system of claim 8 , wherein the seed layer is MgO.

10. The system of claim 8 , wherein the seed layer is AlN.

11. The system of claim 8 , wherein the underlayer is selected from a group consisting of: Cr and CrX, where X includes at least one of W, Mo, V, and Ti.

12. The system of claim 8 , wherein the hard bias layer is selected from a group consisting of: CoPt and CoPtY, where Y includes at least one of Cr, B, and N.

13. The system of claim 8 , further comprising a cap layer formed above the hard bias layer.

14. A method for forming the system of claim 8 , the method comprising:

forming the amorphous insulative layer encapsulating the sensor stack;

forming the nanocrystalline seed layer on the amorphous insulative material;

forming the chromium-containing underlayer on the seed layer; and

forming the hard bias layer on the underlayer.

15. The method of claim 14 , wherein the seed layer is consisting of MgO or AlN.

16. The method of claim 14 , wherein the chromium-containing underlayer is epitaxially formed relative to the seed layer, wherein the hard bias layer is epitaxially formed relative to the underlayer.

17. The method of claim 14 , wherein the underlayer is selected from a group consisting of: Cr and CrX, where X includes at least one of W, Mo, V, and Ti.

18. The method of claim 14 , wherein the hard bias layer is selected from a group consisting of: CoPt and CoPtY, where Y includes at least one of Cr, B, and N.

19. The method of claim 14 , further comprising annealing the seed layer for altering a nanocrystallinity thereof.

20. A method for forming the system of claim 8 , the method comprising:

forming the nanocrystalline seed layer along the sides of the sensor stack and extending horizontally away therefrom, the seed layer being electrically insulative;

epitaxially forming the chromium-containing underlayer on the seed layer; and

epitaxially forming the hard bias layer on the underlayer.

21. The method of claim 20 , wherein the seed layer is consisting of MgO or AlN.

22. The method of claim 20 , wherein the chromium-containing underlayer is epitaxially formed relative to the seed layer, wherein the hard bias layer is epitaxially formed relative to the underlayer.

23. The method of claim 20 , wherein the underlayer is selected from a group consisting of: Cr and CrX, where X includes at least one of W, Mo, V, and Ti.

24. The method of claim 20 , wherein the hard bias layer is selected from a group consisting of CoPt and CoPtY, where Y includes at least one of Cr, B, and N.

25. The method of claim 20 , further comprising annealing the seed layer for altering a nanocrystallinity thereof.

Assignments (6)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →