Semiconductor laser device and manufacturing method thereof
View Patent ↗A semiconductor laser device includes a first semiconductor laser element and a second semiconductor laser element. The first semiconductor laser element has a first end face window structure that is a region including first impurities formed near an end face, and the second semiconductor laser element has a second end face window structure that is a region including second impurities formed near an end face. The distance from a lower end of a first active layer to a lower end of the first end face window structure is shorter than the distance from a lower end of a second active layer to a lower end of the second end face window structure.
1. A semiconductor laser device, comprising:
a first semiconductor laser element and a second semiconductor laser element formed on a semiconductor substrate of a first conductivity type, wherein
the first semiconductor laser element has a first first-conductivity-type cladding layer, a first active layer including an Al x Ga 1-x As layer (where 0≦x≦1), a first second-conductivity-type cladding layer, and a first contact layer which are sequentially formed on the semiconductor substrate in this order, and has a first end face window structure that is a region including first impurities and formed near an end face,
the second semiconductor laser element has a second first-conductivity-type cladding layer, a second active layer including an (Al y Ga 1-y ) z In 1-z P layer (where 0≦y≦1, 0≦z≦1), a second second-conductivity-type cladding layer, and a second contact layer which are sequentially formed on the semiconductor substrate in this order, and has a second end face window structure that is a region including second impurities and formed near an end face,
at least one of the first first-conductivity-type cladding layer and the first second-conductivity-type cladding layer contains indium (In),
a lower end of the first end face window structure is located above a lower end of the first first-conductivity-type cladding layer, and
a distance from a lower end of the first active layer to the lower end of the first end face window structure is shorter than a distance from a lower end of the second active layer to a lower end of the second end face window structure.
2. The semiconductor laser device according to claim 1 , wherein an upper end of the first end face window structure is located below an upper end of the first second-conductivity-type cladding layer.
3. The semiconductor laser device according to claim 1 , wherein the lower end of the second end face window structure is located above a lower end of the second first-conductivity-type cladding layer.
4. The semiconductor laser device according to claim 1 , wherein the second semiconductor laser element has a buffer layer formed between the semiconductor substrate and the second first-conductivity-type cladding layer, the second active layer has a narrower bandgap than that of the buffer layer, and the lower end of the second end face window structure reaches the buffer layer.
5. The semiconductor laser device according to claim 4 , wherein the buffer layer is made of (Al y Ga 1-y ) z In 1-z P (where 0≦y≦1, 0≦z≦1) or Al x Ga 1-x As (where 0≦x≦1).
6. The semiconductor laser device according to claim 4 , wherein the buffer layer is a multilayer film made of (Al y Ga 1-y ) z In 1-z P (where 0≦y≦1, 0≦z≦1) or Al x Ga 1-x As (where 0≦x≦1), and an Al composition ratio in each layer of the buffer layer is gradually increased from a side of the semiconductor substrate toward the second first-conductivity-type cladding layer.
7. The semiconductor laser device according to claim 1 , wherein the first contact layer and the second contact layer are a single-layer or multilayer film made of Al x Ga 1-x As (where 0≦x≦1), and the first contact layer has a thickness equal to or more than that of the second contact layer.
8. The semiconductor laser device according to claim 1 , wherein the first contact layer and the second contact layer are a single-layer or multilayer film made of Al x Ga 1-x As (where 0≦x≦1), and the first contact layer has an Al composition ratio equal to or less than that of the second contact layer.
9. The semiconductor laser device according to claim 1 , wherein the first second-conductivity-type cladding layer and the second second-conductivity-type cladding layer are a single-layer or multilayer film made of (Al y Ga 1-y ) z In 1-z P (where 0≦y≦1, 0≦z≦1), and the first second-conductivity-type cladding layer has a thickness equal to or less than that of the second second-conductivity-type cladding layer.
10. The semiconductor laser device according to claim 1 , wherein the first second-conductivity-type cladding layer and the second second-conductivity-type cladding layer are a single-layer or multilayer film made of (Al y Ga 1-y ) z In 1-z P (where 0≦y≦1, 0≦z≦1), and the first second-conductivity-type cladding layer has an Al composition ratio equal to or less than that of the second second-conductivity-type cladding layer.
11. The semiconductor laser device according to claim 1 , wherein the first second-conductivity-type cladding layer and the second second-conductivity-type cladding layer include a first etch stop layer and a second etch stop layer, respectively, the first etch stop layer is a single-layer or multilayer film made of Al x Ga 1-x As (where 0≦x≦1), and the second etch stop layer is a single-layer or multilayer film made of (Al y Ga 1-y ) z In 1-z P (where 0≦y≦1, 0z≦1).
12. The semiconductor laser device according to claim 1 , wherein the first first-conductivity-type cladding layer, the first active layer, the first second-conductivity-type cladding layer, and the first contact layer are formed by single continuous crystal growth, and the second first-conductivity-type cladding layer, the second active layer, the second second-conductivity-type cladding layer, and the second contact layer are formed by single continuous crystal growth.
13. The semiconductor laser device according to claim 1 , further comprising a current blocking layer for limiting a current injection position in the first active layer and the second active layer, wherein the current blocking layer is an insulating layer.
14. The semiconductor laser device according to claim 1 , further comprising a current blocking layer for limiting a current injection position in the first active layer and the second active layer, wherein the current blocking layer is a semiconductor layer of a first conductivity type.
15. The semiconductor laser device according to claim 1 , wherein the first impurities and the second impurities are a same material.
16. The semiconductor laser device according to claim 1 , wherein the first impurities and the second impurities are zinc (Zn) or silicon (Si).
17. A method for manufacturing a semiconductor laser device, comprising the steps of:
(a) forming on a semiconductor substrate of a first conductivity type a first semiconductor layer having a first first-conductivity-type cladding layer, a first active layer including an Al x Ga 1-x As layer (where 0≦x≦1), and a first second-conductivity-type cladding layer;
(b) implanting first impurities to an end face region of the first semiconductor layer;
(c) after the step (b), selectively removing the first semiconductor layer;
(d) after the step (c), forming a second semiconductor layer having a second first-conductivity-type cladding layer, a second active layer including an (Al y Ga 1-y ) z In 1-z P layer (where 0≦y≦1, 0≦z≦1), and a second second-conductivity-type cladding layer; and
(e) disordering a region from an upper portion of the second semiconductor layer at least to the second active layer by introducing second impurities to an end face region of the second semiconductor layer.