Solid-state imaging device
View Patent ↗A solid-state imaging device includes: an imaging area in which light receiving portions are disposed; an interconnect layer disposed on the light receiving portions, the interconnect layer including metal interconnects having openings and first insulating films; inner-layer lenses formed over the interconnect layer in one-to-one relationship with the light receiving portions; a transparent second insulating film formed on the interconnect layer and the inner-layer lenses; top lenses formed on the second insulating film in one-to-one relationship with the light receiving portions, an upper face of each of the top lenses being a convexly curved face; and a transparent film on the top lenses, the transparent film being formed of a material having a refractive index smaller than a refractive index of the top lenses. In this way, a focal point of at least part of incident light can be situated above a semiconductor substrate.
1. A solid-state imaging device comprising:
an imaging area including a plurality of light receiving portions formed on a semiconductor substrate;
a multi-layered interconnect layer disposed on the plurality of light receiving portions, the multi-layered interconnect layer including metal interconnects and insulating films;
first lenses formed on the multi-layered interconnect layer in one-to-one relationship with the light receiving portions;
second lenses formed above the first lenses; and
a transparent film formed on the second lenses, wherein
a refractive index of the transparent film is smaller than a refractive index of the second lenses,
a thickness of the second lenses is greater than a thickness of the first lenses,
the plurality of light receiving portions, the first lenses, and the second lenses are disposed two-dimensionally in a vertical direction and a horizontal direction in the imaging area,
the second lenses adjacent to each other in the horizontal direction are in connection with each other, and
an upper face of each of the second lenses has a curvature smaller in the horizontal direction than in a diagonal direction.
2. The solid-state imaging device of claim 1 , wherein an upper face of the transparent film is flat.
3. The solid-state imaging device of claim 1 , wherein an upper face of the transparent film is curved.
4. The solid-state imaging device of claim 1 , further comprising:
an adhesive material disposed on the transparent film; and
a transparent component formed on the adhesive material.
5. The solid-state imaging device of claim 1 , further comprising a transparent component formed on the transparent film.
6. The solid-state imaging device of claim 1 , wherein at least one of the metal interconnects, the first lenses, and the second lenses in the periphery of the imaging area are shifted, on a basis of positions of the light receiving portions, toward or apart from the center of the imaging area.
7. The solid-state imaging device of claim 1 , wherein an upper face of each of the first lenses is convexly curved face.
8. The solid-state imaging device of claim 1 , wherein a lower face of each of the first lenses is downward convexly curved face.
9. The solid-state imaging device of claim 1 , wherein the first lenses are formed of an inorganic material.
10. The solid-state imaging device of claim 1 , wherein the second lenses are formed of an organic material.