Rotational vibration measurements in computer systems
Embodiments of a mechanical device to facilitate in-situ measurements of vibration associated with a corresponding component in a computer system are described. This mechanical device includes a housing that has approximately a same mass as the component, approximately a same distribution of mass about a geometric center of the component, and approximately a same form factor as the component. Moreover, the mechanical device includes one or more vibration sensors, which are mechanically coupled to the housing, and which are configured to perform the in-situ vibration measurements.
1. A mechanical device to facilitate in-situ measurements of vibration associated with a corresponding component in a computer system, comprising:
a housing that has approximately a same mass as the component, approximately a same distribution of mass about a geometric center of the component, and approximately a same form factor as the component; and
one or more vibration sensors, mechanically coupled to the housing, configured to perform the in-situ vibration measurements.
2. The mechanical device of claim 1 , wherein the vibration includes rotational vibration.
3. The mechanical device of claim 1 , wherein the mechanical device is configured to mount in the computer system.
4. The mechanical device of claim 1 , wherein the mechanical device is configured to mechanically couple to a chassis in the computer system.
5. The mechanical device of claim 1 , wherein the one or more vibration sensors include one or more accelerometers.
6. The mechanical device of claim 5 , wherein the one or more accelerometers include one or more linear accelerometers.
7. The mechanical device of claim 5 , wherein the one or more accelerometers include one or more torsional accelerometers.
8. The mechanical device of claim 5 , wherein the one or more accelerometers include two accelerometers configured to measure vibration approximately in a symmetry plane of the mechanical device.
9. The mechanical device of claim 5 , wherein the one or more accelerometers include four accelerometers configured to measure vibration approximately in a symmetry plane of the mechanical device and approximately out of the plane.
10. The mechanical device of claim 9 , wherein at least one of the accelerometers is configured to measure the vibration along a first direction,
wherein the other accelerometers are configured to measure the vibration along at least a second direction; and
wherein the first direction is different than the second direction.
11. The mechanical device of claim 9 , further comprising an analysis circuit which is configured to average vibration measurements of pairs of the four accelerometers.
12. The mechanical device of claim 9 , further comprising an analysis circuit which is configured to compare vibration measurements of pairs of the four accelerometers in order to determine vibration in three dimensions.
13. The mechanical device of claim 1 , wherein the one or more vibration sensors have a separation from each other which is greater than a pre-determined value.
14. The mechanical device of claim 13 , wherein the pre-determined value corresponds to a maximum separation permitted by the housing.
15. The mechanical device of claim 1 , wherein the component includes a hard-disk drive (HDD).
16. The mechanical device of claim 1 , further comprising a communication circuit, wherein the communication circuit is configured to communicate vibration measurements to a remote location, thereby facilitating remote data collection from the computer system.
17. The mechanical device of claim 1 , further comprising a data-logger circuit configured to store vibration measurements for subsequent analysis.
18. A computer system, comprising:
a chassis including slots;
multiple components mechanically coupled to the chassis, wherein a given component is mounted in a given slot in the chassis; and
a mechanical device mechanically coupled to the chassis, wherein the mechanical device is mounted in one of the slots, and wherein the mechanical device includes:
a housing that has approximately a same mass as the component, approximately a same distribution of mass about a geometric center of the component, and approximately a same form factor as the component, wherein the mechanical device excludes functional elements of the component; and
one or more vibration sensors, mechanically coupled to the housing, configured to perform in-situ vibration measurements in the computer system.
19. The computer system of claim 18 , further comprising a continuous telemetry system configured to collect telemetry signals, including the vibration measurements, during operation of the computer system; and
an analysis circuit to analyze the telemetry signals to determine a change in at least one of the components, thereby facilitating remedial action.
20. A method for performing in-situ vibration measurements associated with a component in a computer system, comprising:
mechanically coupling a mechanical device in a slot in a chassis in the computer system, wherein the mechanical device has approximately a same mass as the component, approximately a same distribution of mass about a geometric center of the component, and approximately a same form factor as the component; and
performing the in-situ vibration measurements using one or more vibration sensors internal to the mechanical device.