IP Library Granted Patent US 7,729,401
Granted Patent B2
US 7,729,401 · App. 12/167,559 · Granted Jun 1, 2010

Semiconductor laser device and fabrication method for the same

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Quick Facts
Patent No.
US 7,729,401
App. No.
12/167,559
Granted
Jun 1, 2010
Kind
B2
Abstract

The semiconductor laser device includes a cavity structure having a first clad layer, an active layer and a second clad layer formed on a substrate. The second clad layer has a stripe portion extending between the front end face from which laser light is extracted and the rear end face opposite to the front end face. The stripe portion has a first region located closer to the front end face, a second region located closer to the rear end face and a change region whose width changes located between the first and second regions. The effective refractive index difference between the inside and outside of the stripe portion in the change region is greater than that in the first region.

Claims (49)

1. A semiconductor laser device comprising:

a cavity structure including a first clad layer, an active layer and a second clad layer sequentially formed on a substrate,

wherein the second clad layer has a stripe portion extending between a front end face from which laser light is extracted and a rear end face opposite to the front end face,

the stripe portion has a first region located closer to the front end face, a second region located closer to the rear end face and a change region whose stripe width changes located between the first region and the second region,

the effective refractive index difference between the inside and outside of the stripe portion in the change region is greater than the effective refractive index difference between the inside and outside of the stripe portion in the first region,

the active layer is made of a material represented by a general formula (Al a Ga b ) c In 1-c P (0≦a<1, 0<b≦1, a+b=1, 0<c<1),

the first and second clad layers are made of a material represented by a general formula (Al d Ga e ) f In 1-f P (0<d<1, 0<e<1, d+e=1, 0<f<1), and

the stripe portion is a ridge stripe portion, and

wherein the device further comprises a first current block layer covering sidewalls of the ridge stripe portion in the first region and a second current block layer covering sidewalls of the ridge stripe portion in the change region, and

the refractive index of the first current block layer is greater than the refractive index of the second current block layer.

2. The semiconductor laser device of claim 1 , wherein the first region includes a fixed-width portion whose width is fixed, and

the fixed-width portion has a length of 10 μm or more.

3. The semiconductor laser device of claim 1 , wherein the reflectance of the front end face is equal to or smaller than the reflectance of the rear end face, and

the stripe width is larger at the front end face than at the rear end face.

4. The semiconductor laser device of claim 1 , wherein the active layer is a quantum well active layer.

5. The semiconductor laser device of claim 4 , wherein at least one of a region near the front end face and a region near the rear end face is disorganized by impurity diffusion.

6. The semiconductor laser device of claim 1 , wherein the first current block layer and the second current block layer are made of dielectric materials different from each other.

7. The semiconductor laser device of claim 1 , wherein the first current block layer and the second current block layer are made of the same dielectric material.

8. The semiconductor laser device of claim 1 , wherein the first current block layer and the second current block layer are respectively made of any one of, or a compound containing at least two of, SiO 2 , SiN x , Al 2 O 3 , TiO 2 , ZrO 2 , Ta 2 O 5 , CeO 2 and Nb 2 O 5 .

9. A fabrication method for a semiconductor laser device, comprising the steps of:

(a) sequentially forming a first clad layer, an active layer and a second clad layer on a substrate;

(b) forming a stripe portion having a change region whose stripe width changes by etching the second clad layer; and

(c) forming a first current block layer so as to cover a region other than the change region and a second current block layer so as to cover the change region,

wherein in the step (c), the first current block layer and the second current block layer are formed so that the effective refractive index difference between the inside and outside of the stripe portion in the change region is greater than the effective refractive index difference between the inside and outside of the stripe portion in the region other than the change region,

the active layer is made of a material represented by a general formula (Al a Ga b ) c In 1-c P (0≦a<1, 0<b≦1, a+b=1, 0<c<1),

the first and second clad layers are made of a material represented by a general formula (Al d Ga e ) f In 1-f P (0<d<1, 0<e<1, d+e=1, 0<f<1),

the stripe portion is a ridge stripe portion,

said first current block layer covering sidewalls of the ridge stripe portion in the first region and said second current block layer covering sidewalls of the ridge stripe portion in the change region, and

the refractive index of the first current block layer is greater than the refractive index of the second current block layer.

10. A semiconductor laser device comprising:

a cavity structure including a first clad layer, an active layer and a second clad layer sequentially formed on a substrate,

wherein the second clad layer has a stripe portion extending between a front end face from which laser light is extracted and a rear end face opposite to the front end face,

the stripe portion has a first region located closer to the front end face, a second region located closer to the rear end face and a change region whose stripe width changes located between the first region and the second region,

the effective refractive index difference between the inside and outside of the stripe portion in the change region is greater than the effective refractive index difference between the inside and outside of the stripe portion in the first region,

wherein the active layer is made of a material represented by a general formula Al a Ga 1-a As (0≦a<1), and

the first and second clad layers are made of a material represented by a general formula (Al d Ga e ) f In 1-f P (0<d<1, 0<e<1, d+e=1, 0<f<1), and

the stripe portion is a ridge stripe portion, and

wherein the device further comprises a first current block layer covering sidewalls of the ridge stripe portion in the first region and a second current block layer covering sidewalls of the ridge stripe portion in the change region, and

the refractive index of the first current block layer is greater than the refractive index of the second current block layer.

11. A fabrication method for a semiconductor laser device, comprising the steps of:

(a) sequentially forming a first clad layer, an active layer and a second clad layer on a substrate;

(b) forming a stripe portion having a change region whose stripe width changes by etching the second clad layer; and

(c) forming a first current block layer so as to cover a region other than the change region and a second current block layer so as to cover the change region,

wherein in the step (c), the first current block layer and the second current block layer are formed so that the effective refractive index difference between the inside and outside of the stripe portion in the change region is greater than the effective refractive index difference between the inside and outside of the stripe portion in the region other than the change region,

wherein the active layer is made of a material represented by a general formula Al a Ga 1-a As (0≦a<1), and

the first and second clad layers are made of a material represented by a general formula (Al d Ga e ) f In 1-f P (0<d<1, 0<e<1, d+e=1, 0<f<1),

the stripe portion is a ridge stripe portion,

said first current block layer covering sidewalls of the ridge stripe portion in the first region and said second current block layer covering sidewalls of the ridge stripe portion in the change region, and

the refractive index of the first current block layer is greater than the refractive index of the second current block layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →
CHANGE OF NAME Recorded Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0624 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2008
From: TAKAYAMA, TORU; SATO, TOMOYA; KIDOGUCHI, ISAO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 021421/0440 →