CMP pad conditioners with mosaic abrasive segments and associated methods

1. A CMP pad conditioner, comprising:

a plurality of abrasive segments, each abrasive segment including:

a segment blank; and

an abrasive layer including individual abrasive grits attached to the segment blank by a brazing alloy, the abrasive layer including a superhard abrasive material; and

a pad conditioner substrate;

each of the plurality of abrasive segments being permanently affixed to the pad conditioner substrate by an organic material layer in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another, wherein each of the abrasive layers includes an abrading surface or point, and wherein the abrading surfaces or points are leveled relative to one another such that no abrading surface or point protrudes above another abrading surface or point by more than about 30 microns.

2. The pad conditioner of claim 1 , wherein at least some of the plurality of abrasive segments are radially distributed about a face of the pad conditioner substrate.

3. The pad conditioner of claim 1 , wherein at least two of the plurality of abrasive segments differ in at least one of: a geometric configuration; an abrasive layer material; and an abrasive profile.

4. The pad conditioner of claim 1 , wherein arrangement of the abrasive segments on the face of the pad conditioner substrate uniformly distributes drag forces across substantially each abrasive segment.

5. The pad conditioner of claim 1 , wherein a longitudinal axis of each of the plurality of abrasive segments is aligned along a radius of the pad conditioner substrate.

6. The pad conditioner of claim 1 , wherein each of the abrasive layers includes an abrading surface or point, and wherein at least one abrading surface or point is oriented at a greater elevation than is an abrading surface or point of an immediately adjacent abrasive layer.

7. The pad conditioner of claim 1 , wherein each of the plurality of segment blanks are permanently affixed to the pad conditioner substrate with an organic material layer including one or more of: amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and mixtures thereof.

8. The pad conditioner of claim 1 , wherein the abrasive layers comprise PCD blades.

9. The pad conditioner of claim 1 , wherein each of the abrasive layers includes a cutting face, and wherein each cutting face is angled at 90 degrees or less relative to a finished surface of the CMP pad.

10. A method of forming a CMP pad conditioner, comprising:

obtaining a plurality of abrasive segments, each abrasive segment including:

a segment blank; and

an abrasive layer including individual abrasive grits attached to the segment blank by a brazing alloy, the abrasive layer including a superhard abrasive material;

positioning the at least one abrasive segment on a face of a pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another; and

permanently affixing the at least one abrasive segment to the pad conditioner substrate with an organic material layer, wherein each of the abrasive layers includes an abrading surface or point, and wherein the abrading surfaces or points are leveled relative to one another such that no abrading surface or point protrudes above another abrading surface or point by more than about 30 microns.