IP Library Granted Patent US 8,221,897
Granted Patent B2
US 8,221,897 · App. 12/168,937 · Granted Jul 17, 2012

Rolled copper foil

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Quick Facts
Patent No.
US 8,221,897
App. No.
12/168,937
Granted
Jul 17, 2012
Kind
B2
Abstract

A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200} Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle α, the normalized intensity being obtained during a β scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle α in a range of 40° to 60° to a maximum value B of the normalized intensity with angle α in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle α in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Claims (21)

1. A rolled copper foil obtained after a final cold rolling step but before a recrystallization annealing step, and having a crystal grain alignment

in which, in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface of the rolled copper foil, the crystal grain alignment indicates a ratio of A/B≧4, where A and B are local maximum values of normalized intensities of a {200} Cu plane diffraction of a copper crystal, which are respectively obtained by β-scanning of an in-plane rotation axis within an α-angle range of a deflection axis from 40° to 60° and another α-angle range from 80° to 90°; and

there is essentially no area increasing the normalized intensity of the {200} Cu plane diffraction stepwise from α-angle of 25° to α-angle of 45°.

2. The rolled copper foil according to claim 1 , wherein:

in results obtained by an X-ray diffraction 2θ/θ measurement for the rolled surface, 80% or more of diffraction peaks of the copper crystal occurs on a {220} Cu plane.

3. The rolled copper foil according to claim 1 , wherein:

the rolled copper foil is made of a copper alloy including Sn by 0.001 to 0.009 mass % and a balance comprising Cu and an inevitable impurity.

4. The rolled copper foil according to claim 1 , including a crystal grain alignment wherein:

in results obtained by an X-ray diffraction 2θ/θ measurement for the rolled surface after having been subjected to the recrystallization annealing step, 90% or more of diffraction peaks of the copper crystal occurs on the {200} Cu plane.

5. The rolled copper foil according to claim 1 , wherein:

the rolled copper foil is made of a tough pitch copper or an oxygen-free copper.

6. A polycrystalline copper foil having a crystal grain alignment, in which, in results obtained by an X-ray diffraction pole figure measurement with respect to a surface of the polycrystalline copper foil, the crystal grain alignment indicates a ratio of A/B≧4, where A and B are local maximum values of normalized intensities of a {200} Cu plane diffraction of a copper crystal, which are respectively obtained by βscanning of an in-plane rotation axis within an α-angle range of a deflection axis from 40 to 60° and another a-angle from 80° to 90°; and

the normalized intensity of the {200} Cu plane diffraction increases monotonously and an inclination of a curve of the normalized intensities does not decrease from α-angle of 25° to α-angle of 45°.

7. The polycrystalline copper foil according to claim 6 , wherein:

in results obtained by an X-ray diffraction 2θ/θ measurement for the rolled surface, 80% or more of diffraction peaks of the copper crystal occurs on a {220} Cu plane.

8. The polycrystalline foil according to claim 6 , wherein:

the rolled copper foil is made of a copper alloy including Sn by 0.001 to 0.009 mass % and a balance comprising Cu and an inevitable impurity.

9. A polycrystalline foil applied with the recrystallization annealing to the rolled copper foil according to claim 6 , including a crystal grain alignment wherein:

in results obtained by an X-ray diffraction 2θ/θ measurement for the rolled surface, 90% or more of diffraction peaks of the copper crystal occurs on the {200} Cu plane.

10. The polycrystalline foil according to claim 6 , wherein:

the rolled copper foil is made of a tough pitch copper or an oxygen-free copper.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2013
From: HITACHI CABLE, LTD.
To: SH COPPER PRODUCTS CO., LTD.
Reel/Frame 030754/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2008
From: MUROGA, TAKEMI; ITO, YASUYUKI; AOYAGI, KOJI; YAMAMOTO, YOSHIKI; YOKOMIZO, KENJI
To: HITACHI CABLE, LTD.
Reel/Frame 021202/0183 →