IP Library Granted Patent US 7,932,137
Granted Patent B2
US 7,932,137 · App. 12/169,854 · Granted Apr 26, 2011

Thin film transistor and manufacturing method of the same

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Quick Facts
Patent No.
US 7,932,137
App. No.
12/169,854
Granted
Apr 26, 2011
Kind
B2
Abstract

To achieve TFT having a high light-resistance characteristic with a suppressed light leak current at low cost by simplifying the manufacturing processes. The TFT basically includes a light-shielding film formed on a glass substrate that serves as an insulating substrate; an insulating film formed on the light-shielding film; a semiconductor film formed on the insulating film; and a gate insulating film formed on the semiconductor film. Each layer of a laminate that is configured with three layers of the light-shielding film, the insulating film, and the semiconductor film is patterned simultaneously. Further, each layer of the laminate is configured with silicon or a material containing silicon.

Claims (9)

1. A method for manufacturing a thin film transistor that comprises:

a light-shielding film formed on an insulating substrate, an insulating film formed on the light-shielding film, a semiconductor film formed on the insulating film, and a gate insulating film formed on the semiconductor film, wherein a sum of film thicknesses of the light-shielding film and the insulating film is equal to or less than a film thickness of the semiconductor film; and

a sum of film thicknesses of the lightshielding film, the insulating film, and the semiconductor film is equal to or less than a film thickness of the gate insulating film, the method comprising:

using silicon or a material containing silicon for the light-shielding film, the insulating film, and the semiconductor film;

forming the light-shielding film, the insulating film, and the semiconductor film on the insulating substrate continuously in a same CVD device; and

then simultaneously patterning the light-shielding film, the insulating film, and the semiconductor film in a same etching device.

2. The method for manufacturing a thin film transistor as claimed in claim 1 , wherein the CVD device is a plasma CVD device, and the etching device is a plasma etching device.

3. The method for manufacturing a thin film transistor as claimed in claim 2 , wherein the semiconductor film and the light-shielding film are made of silicon, and the insulating film is made of silicon oxide.

4. The method for manufacturing a thin film transistor as claimed in claim 3 , wherein the semiconductor film is made of polycrystalline silicon, and the light-shielding film is made of amorphous silicon.

Assignments (2)
CHANGE OF NAME Recorded Nov 8, 2011
From: NEC LCD TECHNOLOGIES, LTD.
To: NLT TECHNOLOGIES, LTD.
Reel/Frame 027190/0060 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2008
From: TANABE, HIROSHI
To: NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 021213/0024 →