Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste
View Patent ↗An image intensifier includes a microchannel plate (MCP) having an output surface, and a ceramic substrate having an outer surface. The output surface of the MCP and the outer surface of the ceramic substrate are oriented facing each other. An imager is substantially buried within the ceramic substrate, and an input surface of the imager is exposed to receive electrons from the output surface of the MCP. The input surface of the imager and the outer surface of the ceramic substrate are oriented in substantially the same plane. The input surface of the imager and the outer surface of the ceramic substrate are disposed at a very close distance from the output surface of the MCP. The imager includes input/output pads, and the ceramic substrate includes input/output pads. A conductive epoxy connects a respective input/output pad of the imager to a respective input/output pad of the ceramic substrate.
1. An image intensifier comprising
a microchannel plate (MCP) having an output surface, and
a ceramic substrate having an outer surface,
wherein the output surface of the MCP and the outer surface of the ceramic substrate are oriented facing each other,
an imager is substantially buried within the ceramic substrate, and
an input surface of the imager is exposed to receive electrons from the output surface of the MCP; and
the ceramic substrate includes a pocket having a seat at a predetermined depth,
the imager is configured to be received in the pocket,
a bottom surface of the imager is disposed directly on top of the seat, and
the top surface of the ceramic substrate and the input surface of the imager are substantially coplanar;
a conductive epoxy spans between (a) input/output pads disposed on the input surface of the imager and (b) input/output pads disposed on the top surface of the ceramic substrate for electrically connecting the imager to the ceramic substrate; and
a non-conductive epoxy is deposited in the pocket, and
the non-conductive epoxy is configured to fill gaps between (a) end surfaces of the imager inserted in the pocket and (b) walls of the pocket.
2. The image intensifier of claim 1 wherein the input surface of the imager and the outer surface of the ceramic substrate are disposed at a distance from the output surface of the MCP that is less than or equal to 0.005 inches.
3. The image intensifier of claim 1 wherein the imager includes a CMOS (complementary metal oxide semiconductor) device.
4. The image intensifier of claim 1 wherein the imager includes a CCD (charge coupled device).
5. An image intensifier comprising
an electron gain device having an output surface,
an electron sensing device having an input surface, positioned below the output surface of the electron gain device, for receiving light from the output surface of the electron gain device, and
a ceramic substrate disposed below the output surface of the electron gain device for housing the electron sensing device,
wherein
the ceramic substrate includes a pocket for housing the electron sensing device, and
the pocket is of a predetermined depth, so that the top surface of the ceramic substrate is substantially coplanar with the input surface of the electron sensing device; and
input/output pads are disposed on the top surface of the ceramic substrate,
input/output pads are disposed on the input surface of the electron sensing device, and
multiple conductive epoxy spanning between the input/output pads of the ceramic substrate and the electron sensing device to provide electrical connections; and
non-conductive epoxy is disposed below at least one conductive epoxy span for providing support to the at least one conductive epoxy span.
6. The image intensifier of claim 5 wherein the electronic sensing device is an imager, and
the electron gain device is an MCP.