IP Library Granted Patent US 7,848,064
Granted Patent B2
US 7,848,064 · App. 12/172,134 · Granted Dec 7, 2010

Enhanced anti-parallel-pinned sensor using thin ruthenium spacer and high magnetic field annealing

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Quick Facts
Patent No.
US 7,848,064
App. No.
12/172,134
Granted
Dec 7, 2010
Kind
B2
Abstract

An anti-parallel pinned sensor is provided with a spacer that increases the anti-parallel coupling strength of the sensor. The anti-parallel pinned sensor is a GMR or TMR sensor having a pure ruthenium or ruthenium alloy spacer. The thickness of the spacer is less than 0.8 nm, preferably between 0.1 and 0.6 nm. The spacer is also annealed in a magnetic field that is 1.5 Tesla or higher, and preferably greater than 5 Tesla. This design yields unexpected results by more than tripling the pinning field over that of typical AP-pinned GMR and TMR sensors that utilize ruthenium spacers which are 0.8 nm thick and annealed in a relatively low magnetic field of approximately 1.3 Tesla.

Claims (17)

1. A method of increasing the coupling strength of a sensor, the method comprising:

(a) providing a ruthenium spacer having a thickness of less than 0.8 nm;

(b) forming a sensor with the ruthenium spacer; and

(c) annealing the ruthenium spacer in a magnetic field that is greater than 2.5 Tesla.

2. The method of claim 1 , wherein the sensor is an anti-parallel pinned sensor.

3. The method of claim 1 , wherein the sensor is selected from the group consisting of GMR and TMR sensors.

4. The method of claim 1 , wherein the ruthenium spacer is a ruthenium alloy.

5. The method of claim 1 , wherein the ruthenium spacer is pure ruthenium.

6. The method of claim 1 , wherein the thickness of the ruthenium spacer is between 0.1 and 0.6 nm.

7. A method of increasing the anti-parallel coupling strength of an anti-parallel pinned sensor, the method comprising:

(a) providing a ruthenium spacer having a thickness of less than 0.8 nm;

(b) forming an anti-parallel pinned sensor with the ruthenium spacer; and

(c) annealing the ruthenium spacer in a magnetic field that is greater than 2.5 Tesla.

8. The method of claim 7 , wherein the anti-parallel pinned sensor is selected from the group consisting of GMR and TMR sensors.

9. The method of claim 7 , wherein the ruthenium spacer is a ruthenium alloy.

10. The method of claim 7 , wherein the ruthenium spacer is pure ruthenium.

11. The method of claim 7 wherein the thickness of the ruthenium spacer is between 0.1 and 0.6 nm.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2008
From: LEE, WEN-YAUNG; LI, JINSHAN; MAURI, DANIELE; NISHIOKA, KOICHI; TAJIMA, YASUNARI
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 021436/0178 →