IP Library Patent Application 12172651
Patent Application
App. No. 12/172,651

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

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Patent No.
US None
App. No.
12/172,651
Abstract

A complementary semiconductor device comprising an n-channel transistor and a p-channel transistor, including: the n-channel transistor including a gate insulating film and a first metal gate electrode formed on the gate insulating film and having a first compound layer including a first metal (M 1 ) and silicon (Si); and the p-channel transistor including a gate insulating film and a second metal gate electrode formed on the gate insulating film and having a second compound layer including the first metal (M 1 ), a second metal (M 2 ), and silicon (Si), wherein the composition of the first compound layer is represented by a composition formula: M 1 Si x (1≦x), and the composition of the second compound layer is represented by a composition formula: M 1 M 2 Si y (0<y≦0.5).

Claims (21)

1 . A complementary semiconductor device comprising an n-channel transistor and a p-channel transistor, comprising:

the n-channel transistor including a gate insulating film and a first metal gate electrode formed on the gate insulating film and having a first compound layer including a first metal (M 1 ) and silicon (Si); and

the p-channel transistor including a gate insulating film and a second metal gate electrode formed on the gate insulating film and having a second compound layer including the first metal (M 1 ), a second metal (M 2 ), and silicon (Si), wherein

the composition of the first compound layer is represented by a composition formula: M 1 Si x (1≦x), and

the composition of the second compound layer is represented by a composition formula: M 1 M 2 Si y (0<y≦0.5).

2 . The semiconductor device according to claim 1 , wherein the first metal gate has a W layer on the first compound layer.

3 . The semiconductor device according to claim 1 , wherein the first metal gate has a TiN layer and a NiSi layer on the first compound layer.

4 . The semiconductor device according to claim 1 , wherein the work function of the second metal (M 2 ) is higher than that of the first metal (M 1 ).

5 . The semiconductor device according to claim 1 , wherein the first metal (M 1 ) is a metal selected from the group consisting of Ta, Nb, V, Ti, Hf, Zr, and La.

6 . The semiconductor device according to claim 1 , wherein the second metal (M 2 ) is a metal selected from the group consisting of Ni, Pt, Ru, Ir, Pd, and Co.

7 . A method for producing a complementary semiconductor device having an n-channel transistor and a p-channel transistor, comprising the steps of:

preparing a semiconductor substrate;

defining an n-channel transistor formation region and a p-channel transistor formation region in the semiconductor substrate and forming a gate insulating film, a first compound layer including a first metal (M 1 ) and silicon (Si), and a dummy gate metal layer in the respective regions;

selectively removing the dummy gate metal layer in the p-channel transistor formation region;

forming a second metal (M 2 ) layer to cover the semiconductor substrate; and

forming a metal gate electrode of a second compound layer including the first metal (M 1 ), the second metal (M 2 ), and silicon (Si) by reacting the first compound layer and the second metal (M 2 ) layer in the p-channel transistor formation region by heat treatment.

8 . The semiconductor device production method according to claim 7 , wherein the composition of the first compound layer is represented by a composition formula: M 1 Si x (1≦x) and

the composition of the second compound layer is represented by a composition formula: M 1 M 2 Si y (0<y≦0.5).

9 . The semiconductor device production method according to claim 7 , wherein the work function of the second metal (M 2 ) is higher than that of the first metal (M 1 ).

10 . The semiconductor device production method according to claim 7 , wherein the first metal (M 1 ) is a metal selected from the group consisting of Ta, Nb, V, Ti, Hf, Zr, and La.

11 . The semiconductor device production method according to claim 7 , wherein the second metal (M 2 ) is a metal selected from the group consisting of Ni, Pt, Ru, Ir, Pd, and Co.

Assignments (2)
CHANGE OF NAME Recorded Sep 14, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024982/0558 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2008
From: KADOSHIMA, MASARU
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 021234/0245 →