IP Library Granted Patent US 8,293,279
Granted Patent B2
US 8,293,279 · App. 12/173,382 · Granted Oct 23, 2012

pH-regulated polyamide powder for cosmetic applications

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Quick Facts
Patent No.
US 8,293,279
App. No.
12/173,382
Granted
Oct 23, 2012
Kind
B2
Abstract

The present invention relates to polyamide powders suitable for cosmetic applications are described which have a pH of 4.0 to 7.0, cosmetic compositions containing the polyamide powders and processes of making the same.

Claims (17)

1. A method of making a fine polyamide powder suitable for a cosmetic application, the method comprising adding from 0.01 to 2 parts of a buffer system per 100 parts of polyamide, wherein the buffer system comprises at least one of a natural organic acid, a natural mineral acid, and a corresponding salt thereof, and polyamide powder in a manner to yield a uniform distribution of the buffer system with the polyamide powder,

wherein the resulting fine polyamide powder is suitable for a cosmetic application and has a pH of from 4.0 to 7.0 which is the pH a suspension of 100 ml of water and 1 g of the fine polyamine powder measured after stirring the suspension for 24 hours,

wherein the buffer system is dry and is mixed with a dry blend of the polyamide powder, and

wherein the fine polyamide powder has an average particle diameter d 50 of from 1 to 400 μm.

2. The method as claimed in claim 1 , wherein the polyamide powder has a pH of from 4.5 to 6.5.

3. The method as claimed in claim 1 , wherein the buffer system comprises at least one of a citrate buffer and a phosphate buffer.

4. The method as claimed in claim 1 , wherein the polyamide powder is at least one polyamide selected from the group consisting of polyamide 11 and polyamide 12.

5. The method as claimed in claim 1 , wherein the polyamide powder is obtained by a precipitation process or by an anionic solution polymerization process.

6. The method as claimed in claim 1 , comprising adding from 0.1 to 1 parts of the buffer system per 100 parts of the polyamide.

7. The method as claimed in claim 1 , further comprising grinding the buffer system in the dry state, thereby yielding fine buffer system particles having an average particle diameter smaller than an average particle diameter of the polyamide powder, wherein the ground buffer system penetrates into pores of the polyamide powder particles upon mixing.

8. The method as claimed in claim 1 , wherein the polyamide powder is porous polyamide precipitated powder.

9. The method as claimed in claim 1 , further comprising grinding a mixture of the buffer system and the polyamide powder in the dry state to the desired particle size, wherein the average particle diameter d 50 of the resulting fine polyamide powder less than 20 μm.

10. The method as claimed in claim 1 , further comprising separately grinding the buffer system and the polyamide powder in the dry state to the desired average particle size prior to mixing.

11. The method as claimed in claim 1 , wherein the average particle diameter d 50 of the resulting fine polyamide powder is from 5 to 100 μm.

12. The method as claimed in claim 1 , wherein the average particle diameter d 50 of the resulting fine polyamide powder is from 5 to 60 μm.

13. The method as claimed in claim 1 , wherein the pH is from 5 to 6.

14. The method as claimed in claim 1 , further comprising grinding the buffer system, wherein an average particle diameter d 50 of the ground buffer system is not greater than 10 μm.

Assignments (3)
CHANGE OF NAME Recorded Jan 31, 2020
From: EVONIK DEGUSSA GMBH
To: EVONIK OPERATIONS GMBH
Reel/Frame 051765/0166 →
CHANGE OF NAME Recorded Sep 17, 2012
From: DEGUSSA GMBH
To: EVONIK DEGUSSA GMBH
Reel/Frame 028966/0803 →
CHANGE IN LEGAL FORM Recorded Sep 17, 2012
From: DEGUSSA AG
To: DEGUSSA GMBH
Reel/Frame 028994/0275 →