Image sensor and method for manufacturing the same

1. A method for manufacturing an image sensor, comprising:

forming at least one unit pixel in a semiconductor substrate;

forming an interlayer dielectric on the semiconductor substrate;

forming a color filter on the interlayer dielectric;

forming a planarization layer on the color filter;

forming a microlens on the planarization layer;

performing a plasma treatment process on the microlens; and

forming an inorganic material layer on the microlens after performing the plasma treatment process,

wherein forming the inorganic material layer comprises depositing an oxide layer on the microlens and performing blanket etching on the oxide layer until gaps between the microlens and adjacent microlenses are removed.

2. The method according to claim 1 , wherein the microlens comprises an inorganic material.

3. The method according to claim 1 , wherein the microlens comprises a low temperature oxide.

4. The method according to claim 1 , wherein the plasma treatment process is performed until the microlens has a smooth surface.

5. The method according to claim 1 , wherein performing the plasma treatment process on the microlens comprises using NH 3 gas, H 2 gas, He gas, N 2 gas, or any combination thereof.

6. The method according to claim 1 , wherein performing the plasma treatment process on the microlens comprises supplying a power of from about 100 W to about 500 W.

7. The method according to claim 1 , wherein the plasma treatment process is performed for a period of time of about 50 seconds to about 60 seconds.

8. The method according to claim 1 , wherein the inorganic material layer is a low temperature oxide layer.

9. A method for manufacturing an image sensor, comprising:

forming at least one unit pixel in a semiconductor substrate;

forming an interlayer dielectric on the semiconductor substrate;

forming a color filter on the interlayer dielectric;

forming a planarization layer on the color filter;

forming a microlens on the planarization layer; and

performing a plasma treatment process on the microlens;

wherein forming the microlens comprises:

depositing an oxide layer on the planarization layer;

forming a dummy microlens on the oxide layer; and

etching the oxide layer using the dummy microlens as a mask.

10. The method according to claim 9 , wherein etching the oxide layer using the dummy microlens as a mask comprises over-etching the oxide layer.