IP Library Granted Patent US 8,083,415
Granted Patent B2
US 8,083,415 · App. 12/181,484 · Granted Dec 27, 2011

Line-side out-of-band electrical interface for optoelectronic modules

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,083,415
App. No.
12/181,484
Granted
Dec 27, 2011
Kind
B2
Abstract

Electrical connections from the printed circuit board (“PCB”) of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device.

Claims (42)

1. An out-of-band line-side electrical interface configured to electrically connect a printed circuit board (PCB) of an optoelectronic device to an optical connector removably received within an optical port of the optoelectronic device, comprising:

a lead frame body having a plurality of line-side posts and a plurality of PCB-side posts; and

a plurality of traces embedded within the lead frame body, each of the traces including a line-side contact and a PCB-side contact, wherein each of the line-side contacts is embedded within a corresponding one of the line-side posts and is configured to be in direct contact with and electrically coupled to a corresponding contact on the optical connector when received within the optical port, and each of the PCB-side contacts is embedded within a corresponding one of the PCB-side posts and is configured to be in direct contact with and electrically coupled to a corresponding contact on the printed circuit board.

2. The out-of-band line-side electrical interface of claim 1 , wherein the lead frame body comprises semi-rigid plastic.

3. The out-of-band line-side electrical interface of claim 1 , wherein the lead frame body defines a first saddle for receiving the neck of a transmitter optical subassembly and a second saddle for receiving the neck of a receiver optical subassembly.

4. The out-of-band line-side electrical interface of claim 3 , wherein the lead frame body further includes two posts surrounding the first saddle and second saddle and a post separating the first saddle from the second saddle, each of the surrounding posts and separating post defining a cavity configured to receive a corresponding insertion member of a positioning structure.

5. The out-of-band line-side electrical interface of claim 4 , wherein the lead frame body, the positioning structure, and an end cap are configured to mechanically secure the printed circuit board, transmitter optical subassembly, and receiver optical subassembly within a shell of the optoelectronic device.

6. The out-of-band line-side electrical interface of claim 1 , wherein the out-of-band line-side electrical interface is manufactured by over-molding the lead frame body on the plurality of traces.

7. The out-of-band line-side electrical interface of claim 1 , wherein electrical coupling of the PCB-side contacts to the printed circuit board contacts is configured to be maintained during normal operation without soldering the PCB-side contacts to the printed circuit board contacts.

8. The out-of-band line-side electrical interface of claim 1 , wherein:

the optical connector includes a release latch base with two contacts, one contact each on opposite sides of the release latch base; and

the release latch base is configured to be removably received between two of the plurality of line-side posts such that when received:

a corresponding line-side contact of the two line-side posts is electrically coupled to a different one of the optical connector contacts; and

each line-side post exerts a contact force on a corresponding optical connector contact, the two forces being equal in magnitude and opposite in direction.

9. The out-of-band line-side electrical interface of claim 1 , wherein the plurality of traces are configured for one or more of the following:

enabling electrical communication between a component on the printed circuit board and the optical connector, including one or more of:

relaying digital diagnostic data from a microcontroller on the printed circuit board to the optical connector; and

relaying programming commands, memory codes, or other information from the optical connector to the microcontroller; and

providing electrical power to a light emitting diode or a motor through the optical connector.

10. An optoelectronic device configured to electrically communicate out-of-band through its front or line-side, comprising:

a microcontroller electrically coupled to a printed circuit board (PCB);

an optical port configured to removably receive an optical connector having a plurality of integrated contacts, the optical connector being configured to optically couple an optical transmitter or optical receiver of the optoelectronic device to an optical medium;

a lead frame body having a plurality of line-side posts and a plurality of PCB-side posts; and

a plurality of electrical connections from the printed circuit board to the optical port, the plurality of electrical connections configured to be electrically coupled to the plurality of integrated contacts of the optical connector when received within the optical port such that the microcontroller and optical connector can electrically communicate with each other through the printed circuit board and electrical connections, the plurality of electrical connections embedded within the lead frame body, each of the electrical connections including a line-side contact and a PCB-side contact, wherein each of the line-side contacts is embedded within a corresponding one of the line-side posts and is configured to be in direct contact with and electrically coupled to a corresponding one of the integrated contacts on the optical connector when received within the optical port, and each of the PCB-side contacts is embedded within a corresponding one of the PCB-side posts and is configured to be in direct contact with and electrically coupled to a corresponding contact on the printed circuit board.

11. The optoelectronic device of claim 10 , further comprising an EMI shield separating the microcontroller from the optical port, wherein:

each electrical connection passes through a separate, minimized through hole in the EMI shield; or

the plurality of electrical connections are separated into one or more pairs, each pair passing through a separate, minimized through hole in the EMI shield.

12. The optoelectronic device of claim 10 , wherein the electrical connections comprise a trace structure.

13. The optoelectronic device of claim 10 , wherein the geometry of the optical port and the electrical connections enables the optical port to removably receive a standard optical connector lacking integrated contacts without causing an electrical short circuit between two or more of the electrical connections.

14. An optical connector configured to electrically communicate with an optoelectronic device through an out-of-band line-side electrical interface, comprising:

a release latch configured to engage a corresponding slot in an optical port of an optoelectronic device when the optical connector is removably received within the optical port;

a release latch base supporting the release latch; and

a plurality of electrical traces embedded in the optical connector, each electrical trace including a contact;

wherein the plurality of electrical contacts are configured to be in direct contact with and electrically coupled to corresponding contacts within the optical port when the optical connector is received within the optical port, the corresponding contacts within the optical port provide electrical connections to a microcontroller disposed on a printed circuit board (PCB) of the optoelectronic device, the electrical connections are embedded within a lead frame body having line-side posts and PCB-side posts, each of the electrical connections including a line-side contact and a PCB-side contact, each of the line-side contacts is embedded within a corresponding one of the line-side posts and is configured to be in direct contact with and electrically coupled to a corresponding one of the electrical contacts on the optical connector when received within the optical port, and each of the PCB-side contacts is embedded within a corresponding one of the PCB-side posts and is configured to be in direct contact with and electrically coupled to a corresponding contact on the printed circuit board.

15. The optical connector of claim 14 , further comprising a wireless transmitter configured to wirelessly broadcast electrical data received from the microcontroller, or wirelessly receive electrical data intended for the microcontroller.

16. The optical connector of claim 14 , wherein the geometry of the optical connector and embedded electrical traces enables the optical connector to be removably received within a standard optoelectronic device lacking contacts and electrical connections to a microcontroller without causing an electrical short circuit.

17. The optical connector of claim 14 , wherein:

two of the plurality of contacts are positioned on opposite sides of the release latch base;

two of the corresponding contacts within the optical port are mechanically supported by a different line-side post; and

the release latch base is configured to be removably received between two of the line-side posts such that when received:

each of the two contacts of the optical connector is electrically coupled to a different one of the two contacts within the optical port; and

contact forces exerted by the two line-side posts on the two contacts of the optical connector are balanced.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2008
From: MOORE, JOSHUA; LIGHT, GRETA
To: FINISAR CORPORATION
Reel/Frame 021803/0391 →