Methods to reduce polarization dependent loss in planar lightwave circuits
View Patent ↗Polarization dependent loss may be reduced by providing at least one dummy waveguide or at least one dummy metal structure. Polarization dependent loss may also be reduced by imposing a mechanical force on the OIC to exert mechanical stress thereby changing at least one of the birefringence and the optical axes of at least one waveguide. And polarization dependent loss may be reduced by forming a metal heater using a first set of metal deposition parameters; forming a conductive metal structure contacting the metal heater using a second set of metal deposition parameters; and selecting the first set of metal deposition parameters and the second set of metal deposition parameters to reduce stress.
1. A method of reducing polarization dependent loss in an optical integrated circuit, comprising:
forming an optical integrated circuit comprising a substrate and at least one waveguide having a first birefringence and a first optical axes; and
imposing a mechanical force on the optical integrated circuit to exert mechanical stress thereby changing at least one of the first birefringence and the first optical axes of the at least one waveguide to a second birefringence and a second optical axes,
wherein the optical integrated circuit comprises silicon dioxide on its backside, and the mechanical force is imposed by removing a portion of the silicon dioxide.
2. The method according to claim 1 , wherein the at least one waveguide forms a portion of a coupler.
3. The method according to claim 1 , wherein the optical integrated circuit has a polarization dependent loss reduced by about 20% or more compared to a similar optical integrated circuit not having a mechanical force imposed thereon.
4. The method according to claim 1 , wherein the optical integrated circuit has a polarization dependent loss reduced by about 0.15 dB or more compared to a similar optical integrated circuit not having a mechanical force imposed thereon.
5. The method according to claim 1 , wherein the optical integrated circuit is adjacent a riser, and the mechanical force is further imposed by providing the riser with a first thermal expansion coefficient and the substrate has a second thermal expansion coefficient.
6. The method according to claim 1 , wherein the mechanical force is imposed at about 100 MPa or more.
7. The method according to claim 1 , wherein the optical integrated circuit having at least one of the second birefringence and the second optical axes has a polarization dependent loss reduced by about 10% or more compared to the optical integrated circuit having at least one of the first birefringence and the first optical axes.
8. The method according to claim 1 , wherein the optical integrated circuit having at least one of the second birefringence and the second optical axes has a polarization dependent loss reduced by about 0.1 dB or more compared to the optical integrated circuit having at least one of the first birefringence and the first optical axes.
9. The optical integrated circuit made in accordance with the method of claim 1 .
10. A method of reducing polarization dependent loss in an optical integrated circuit, comprising:
forming an optical integrated circuit comprising a substrate and at least one waveguide having a first birefringence and a first optical axes; and
imposing a mechanical force on the optical integrated circuit to exert mechanical stress thereby changing at least one of the first birefringence and the first optical axes of the at least one waveguide to a second birefringence and a second optical axes, wherein the mechanical force is imposed by depositing metal on top of the optical integrated circuit.
11. The method according to claim 10 , wherein the optical integrated circuit has a polarization dependent loss reduced by about 0.15 dB or more compared to a similar optical integrated circuit not having a mechanical force imposed thereon.
12. A method of reducing polarization dependent loss in an optical integrated circuit, comprising:
forming an optical integrated circuit comprising a substrate and at least one waveguide having a first birefringence and a first optical axes; and
imposing a mechanical force of about 150 MPa or more on the optical integrated circuit to exert mechanical stress thereby changing at least one of the first birefringence and the first optical axes of the at least one waveguide to a second birefringence and a second optical axes,
wherein the mechanical force is imposed by depositing metal on top of the optical integrated circuit.
13. The method according to claim 12 , wherein the mechanical force is further imposed by bending the optical integrated circuit.
14. The method according to claim 12 , wherein the optical integrated circuit is adjacent a riser, and the mechanical force is further imposed by providing the riser with a first thermal expansion coefficient and the substrate has a second thermal expansion coefficient.
15. The method according to claim 12 , wherein the optical integrated circuit is planar lightwave circuit.
16. The method according to claim 12 , wherein the optical integrated circuit having at least one of the second birefringence and the second optical axes has a polarization dependent loss reduced by about 10% or more compared to the optical integrated circuit having at least one of the first birefringence and the first optical axes.
17. The method according to claim 12 , wherein the optical integrated circuit having at least one of the second birefringence and the second optical axes has a polarization dependent loss reduced by about 0.1 dB or more compared to the optical integrated circuit having at least one of the first birefringence and the first optical axes.
18. The optical integrated circuit made in accordance with the method of claim 12 .
19. A method of reducing polarization dependent loss in an optical integrated circuit, comprising:
forming an optical integrated circuit comprising a substrate and at least one waveguide having a first birefringence and a first optical axes; and
imposing a mechanical force of about 150 MPa or more on the optical integrated circuit to exert mechanical stress thereby changing at least one of the first birefringence and the first optical axes of the at least one waveguide to a second birefringence and a second optical axes,
wherein the optical integrated circuit comprises silicon dioxide on its backside, and the mechanical force is imposed by removing a portion of the silicon dioxide.
20. The method according to claim 19 , wherein the optical integrated circuit having at least one of the second birefringence and the second optical axes has a polarization dependent loss reduced by about 10% or more compared to the optical integrated circuit having at least one of the first birefringence and the first optical axes.