Image sensor having multiple sensing layers

1. An image sensor, comprising:

a first sensor layer having a first array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion mechanism, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, the first sensor layer having a thickness to collect light with a first preselected range of wavelengths;

a second sensor layer situated over the first sensor layer, the second sensor layer having a second array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, the second sensor layer being of the same material as the first sensor layer and having a thickness to collect light with a second preselected range of wavelengths;

a color filter array situated over the second sensor layer, wherein the color filter array excludes portions that filter out at least one of the first preselected range of wavelengths and the second preselected range of wavelengths;

a circuit layer separate from the first and second sensor layers and situated below the first sensor layer, the circuit layer having support circuitry for the pixels of the first and second sensor layers; and

interlayer connectors between the pixels of the first and second layers and the support circuitry.

2. The image sensor of claim 1 , wherein the circuit layer includes a charge-to-voltage conversion mechanism coupled to the charge-to-voltage mechanisms of the first and second sensor layer.

3. The image sensor of claim 1 , wherein a plurality of photodiodes are connected to a common charge-to-voltage mechanism.

4. The image sensor of claim 1 , wherein the circuit layer includes a charge-to-voltage mechanism, and wherein the interlayer connections are connected between charge-to-voltage mechanisms of the first and second sensor layers and the circuit layer.

5. The image sensor of claim 1 , further comprising row and column select circuitry that provides the interlayer connections.

6. The image sensor of claim 1 , wherein the first sensor layer and the circuit layer are combined in a single layer having the first array of pixels and the support circuitry.

7. An image sensor, comprising:

a first sensor layer having a first array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion mechanism, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, the first sensor layer having a thickness to collect light with a first preselected range of wavelengths;

a circuit layer of the same material as the first sensor layer and situated below the first sensor layer, the circuit layer having a second array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, support circuitry for the first and second arrays of pixels,

wherein the circuit layer has a thickness to collect light with a second preselected range of wavelengths;

interlayer connectors between the pixels of the first and second layers and the support circuitry; and

a color filter array situated over the first sensor layer, wherein the color filter array excludes portions that filter out at least one of the first preselected range of wavelength and the second preselected range of wavelengths.

8. The image sensor of claim 7 , wherein the interlayer connections are connected between the charge-to-voltage mechanisms of the first sensor layer and the circuit layer.

9. The image sensor of claim 7 , further comprising row and column select circuitry that provides the interlayer connections.

10. A method of binning pixels of an image sensor, comprising:

providing a first pixel kernel situated in a first layer, the first pixel kernel including a first charge-to-voltage mechanism;

providing a second pixel kernel situated in a second layer above the first layer, the second layer including a second charge-to-voltage mechanism and being of the same material as the first layer;

transferring a first charge from a pixel of the first pixel kernel to the first charge-to-voltage mechanism;

transferring a second charge from a pixel of the second pixel kernel to the second charge-to-voltage mechanism; and

transferring the first and second charges via interlayer connections from the first and second charge-to-voltage mechanisms to a common charge-to-voltage mechanism formed on a circuit layer below the first layer.

11. The method of claim 10 , further comprising:

providing a third pixel kernel situated in a third layer above the second layer;

transferring a third charge from a pixel of the third pixel kernel to a third charge-to-voltage mechanism; and

transferring the first, second and third charges to the common charge-to-voltage mechanism.

12. The method of claim 10 , wherein transferring the first charge includes transferring a plurality of charges from a plurality of pixels to the first charge-to-voltage mechanism.

13. An image sensor comprising:

a first pixel kernel situated in a first layer, the first pixel kernel including two or more pixels having a first shared charge-to-voltage mechanism;

a second pixel kernel situated in a second layer above the first layer, the second pixel kernel including two or more pixels having a second shared charge-to-voltage mechanism, and the second layer being of the same material as the first layer; and

a common charge-to-voltage mechanism formed on a circuit layer below the first layer, wherein the common charge-to-voltage mechanism is coupled via interlayer connections to the first and second shared charge-to-voltage mechanisms.

14. The method of claim 13 , further comprising:

a third pixel kernel situated in a third layer above the second layer, the third pixel kernel including two or more pixels having a third shared charge-to-voltage mechanism; and

an interlayer connection from the third shared charge-to-voltage mechanism to the first and second shared charge-to-voltage mechanisms.

15. An image sensor comprising:

a first sensor layer having a first array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion mechanism, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, the first sensor layer having a thickness to collect light with a first preselected range of wavelengths;

a second sensor layer situated over the first sensor layer, the second sensor layer having a second array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, the second sensor layer being of the same material as the first sensor layer and having a thickness to collect light with a second preselected range of wavelengths;

an absorptive color filter array filter situated over the second sensor layer;

a circuit layer separate from the first and second sensor layers and situated below the first sensor layer, the circuit layer having support circuitry for the pixels of the first and second sensor layers; and

interlayer connectors between the pixels of the first and second layers and the support circuitry.

16. The image sensor of claim 15 , wherein the circuit layer includes a charge-to-voltage conversion mechanism coupled to the charge-to-voltage mechanisms of the first and second sensor layer.

17. The image sensor of claim 15 , wherein a plurality of photodetectors are connected to a common charge-to-voltage mechanism.

18. The image sensor of claim 15 , wherein the circuit layer includes a charge-to-voltage mechanism, and wherein the interlayer connections are connected between charge-to-voltage mechanisms of the first and second sensor layers and the circuit layer.

19. The image sensor of claim 15 , further comprising row and column select circuitry that provides the interlayer connections.

20. The image sensor of claim 15 , wherein the first sensor layer and the circuit layer are combined in a single layer having the first array of pixels and the support circuitry.

21. An image sensor, comprising:

a first sensor layer having a first array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion mechanism, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, the first sensor layer having a thickness to collect light with a first preselected range of wavelengths;

a circuit layer of the same material as the first sensor layer and situated below the first sensor layer, the circuit layer having a second array of pixels, each pixel including a photodetector for collecting charge in response to incident light, a charge-to-voltage conversion, and a transfer gate for selectively transferring charge from the photodetector to the charge-to-voltage mechanism, support circuitry for the first and second arrays of pixels; and

wherein the circuit layer has a thickness to collect light with a second preselected range of wavelengths;

interlayer connectors between the pixels of the first and second layers and the support circuitry; and

an absorptive color filter array situated over the first sensor layer.

22. The image sensor of claim 21 , wherein the interlayer connections are connected between the charge-to-voltage mechanisms of the first sensor layer and the circuit layer.

23. The image sensor of claim 21 , further comprising row and column select circuitry that provides the interlayer connections.