Method and apparatus for identifying the chemical composition of a gas
Embodiments of the present invention relate to the analysis of the components of one or more gases, for example a gas mixture sampled from a semiconductor manufacturing process such as plasma etching or plasma enhanced chemical vapor deposition (PECVD). Particular embodiments provide sufficient power to a plasma of the sample, to dissociate a large number of the molecules and molecular fragments into individual atoms. With sufficient power (typically a power density of between 3-40 W/cm 3 ) delivered into the plasma, most of the emission peaks result from emission of individual atoms, thereby creating spectra conducive to simplifying the identification of the chemical composition of the gases under investigation. Such accurate identification of components of the gas may allow for the precise determination of the stage of the process being performed, and in particular for detection of process endpoint.
1. A computer-implemented method, comprising:
sampling a gas in molecular form from a process chamber operating at sub-atmospheric pressure;
applying power to molecules of the gas, such that a significant fraction of optical emissions from a plasma of the gas are from individual atoms of the molecules of the gas resulting from the power being applied to the molecules of the gas; and
determining, using a processor associated with a computer system, relative concentrations of atoms of the gas based at least in part upon measurements of the optical emissions resulting from the power being applied to the molecules of the gas.
2. The method of claim 1 wherein the power applied is such that an intensity of emission from the atoms is at least 20% of an intensity of emission from the gas in molecular form.
3. The method of claim 1 wherein the power applied is such that an intensity of emission from atomic nitrogen in air at 747 nm is at least 20% of an intensity of emission from molecular nitrogen at 747 nm.
4. The method of claim 1 wherein the power applied is such that an intensity of emission from atomic carbon at 248 nm is at least 20% of an intensity of emission from molecular CO at 520 nm for a plasma etching process where silicon oxide is being etched in a fluorocarbon/oxygen chemistry.
5. The method of claim 1 wherein the power applied is such that an intensity of emission from atomic silicon at 251 nm is at least 20% of an intensity of emission from molecular SiF at 440 nm for a plasma etching process where silicon oxide is being etched in a fluorocarbon/oxygen chemistry.
6. The method of claim 1 wherein the power applied is such that an intensity of emission from atomic F at 686 nm is at least 20% of an intensity of emission from molecular CO at 520 nm in a fluorocarbon/oxygen chemistry.
7. The method of claim 1 wherein the plasma is exposed to a power density of 3 W/cm 3 or greater.
8. The method of claim 1 wherein the plasma is exposed to a power density of 5 W/cm 3 or greater.
9. The method of claim 1 wherein the plasma is exposed to a power density of 10 W/cm 3 or greater.
10. The method of claim 1 wherein the plasma is exposed to a power density 20 W/cm 3 or greater.
11. The method of claim 1 wherein the plasma is exposed to a power density of between about 3-40 W/cm 3 .
12. The method of claim 1 wherein the power is applied continuously.
13. The method of claim 1 wherein the power is applied as a pulse.
14. The method of claim 13 wherein a duration of the pulse is between about 0.5-50 milliseconds.
15. The method of claim 13 wherein the pulse occurs at a frequency of between about once per minute and 20 times per second.
16. The method of claim 1 wherein the gas is sampled from a semiconductor processing chamber.
17. The method of claim 16 further comprising determining an endpoint of a process occurring in the semiconductor processing chamber based upon the relative concentrations of atoms of the gas.
18. A computer implemented method, comprising:
sampling a gas in molecular form from a process chamber operating at sub-atmospheric pressure;
exposing molecules of the gas to an RF power having a density of greater than about 3 W/cm 3 to form a plasma, such that a significant fraction of optical emissions from the plasma of the gas are from individual atoms of the molecules of the gas resulting from the RF power being applied to the molecules of the gas;
measuring the optical emissions from the plasma; and
determining, using a processor associated with a computer system, relative concentrations of atoms of the gas based at least in part upon the measured optical emissions resulting from the RF power exposure of the molecules of the gas.
19. The method of claim 18 wherein the gas is sampled from a processing chamber in which a semiconductor fabrication process is being performed.
20. The method of claim 18 further comprising determining an endpoint of the semiconductor fabrication process based upon the relative concentrations of the atoms of the gas.
21. The method of claim 18 wherein the RF power density is applied as a pulse.
22. The method of claim 21 wherein a duration of the pulse is between about 0.5-50 milliseconds.
23. The method of claim 21 wherein the pulse occurs at a frequency of between about once per minute and 20 times per second.
24. An apparatus comprising:
a chamber configured to receive a gas in molecular form from a process chamber operating at sub-atmospheric pressure;
a power generator configured to apply sufficient RF power to molecules of the gas to create a plasma from the gas, such that a significant fraction of optical emissions from the plasma of the gas are from individual atoms of the molecules of the gas resulting from the RF power being applied to the molecules of the gas, the plasma exposed to a power density of greater than about 3 W/cm 3 ; and
a spectrometer in optical communication with the chamber and configured to measure the optical emissions from the plasma.
25. The apparatus of claim 24 further comprising a processor in electronic communication with the spectrometer, the processor configured to correlate the optical emissions with relative concentrations of gases within the chamber.
26. The apparatus of claim 25 wherein the processor is configured to determine a process endpoint based upon the relative concentrations of atoms in the plasma.
27. The apparatus of claim 24 further comprising a pulse generator in electronic communication with the power generator.
28. An apparatus comprising:
a chamber configured to receive a gas in molecular form sampled from a process occurring at sub-atmospheric pressure;
a power generator configured to apply a radio frequency power to molecules of the sampled gas within the chamber, such that a significant fraction of optical emissions from a plasma of the gas are from individual atoms of the molecules of the gas resulting from the radio frequency power being applied to the molecules of the gas; and
a spectrometer in optical communication with the chamber and configured to measure the optical emissions from the plasma of the gas, wherein,
if the sampled gas is from a plasma etching process where silicon oxide is being etched in a fluorocarbon/oxygen chemistry, an intensity of emission from atomic F at 686 nm is at least 20% of an intensity of emission from molecular CO at 520 nm,
if the sampled gas is from a plasma etching process where silicon oxide is being etched in a fluorocarbon/oxygen chemistry, an intensity of emission from atomic silicon at 251 nm is at least 20% of an intensity of emission from molecular SiF at 440 nm,
if the sampled gas is from a plasma etching process where silicon oxide is being etched in a fluorocarbon/oxygen chemistry, an intensity of emission from atomic carbon at 248 nm is at least 20% of an intensity of emission from molecular CO at 520 nm, or
if the sampled gas is air, an intensity of emission from atomic nitrogen at 747 nm is at least 20% of an intensity of emission from molecular nitrogen at 747 nm.
29. The apparatus of claim 28 wherein the power generator is configured to apply the radio frequency power of at least 100 W.
30. The apparatus of claim 28 wherein the power generator is configured to apply the radio frequency power of at least 200 W.
31. The apparatus of claim 28 wherein the power generator is configured to apply the radio frequency power as a pulse having a duration of between about 0.5 and 50 milliseconds, at a frequency of between about once per minute and 20 times per second.
32. The apparatus of claim 28 not requiring a separate cooling mechanism for the chamber.
33. An apparatus comprising:
a chamber configured to receive a gas in molecular form sampled from a process occurring at sub-atmospheric pressure;
a power generator configured to apply a radio frequency power to a plasma of the gas within the chamber, such that a significant fraction of optical emissions from the plasma of the gas are from individual atoms of the molecules of the gas resulting from the radio frequency power being applied to the plasma of the gas; and
a spectrometer in optical communication with the chamber and configured to measure the optical emissions from the plasma, wherein the power generator is configured to apply the radio frequency power of at least 100 W.
34. The apparatus of claim 33 wherein the power generator is configured to apply the radio frequency power as a pulse having a duration of between about 0.5 and 50 milliseconds, at a frequency of between about once per minute and 20 times per second.
35. The apparatus of claim 33 not requiring a separate cooling mechanism for the chamber.
36. An apparatus comprising:
a chamber configured to receive a gas in molecular form sampled from a process occurring at sub-atmospheric pressure;
a power generator configured to apply a radio frequency power to a plasma of the gas within the chamber, such that a significant fraction of optical emissions from the plasma of the gas are from individual atoms of the molecules of the gas resulting from the radio frequency power being applied to the plasma of the gas; and
a spectrometer in optical communication with the chamber and configured to measure the optical emissions from the plasma, wherein the power generator is configured to apply the radio frequency power of at least 200 W.
37. The apparatus of claim 36 wherein the power generator is configured to apply the radio frequency power as a pulse having a duration of between about 0.5 and 50 milliseconds, at a frequency of between about once per minute and 20 times per second.
38. The apparatus of claim 36 not requiring a separate cooling mechanism for the chamber.