Metal-clad laminates having improved peel strength and compositions useful for the preparation thereof
View Patent ↗In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
1. A composition comprising:
(a) a crosslinkable maleimide compound having the structure:
wherein:
X is optionally substituted alkylene or optionally substituted cycloalkylene,
each R is independently H or optionally substituted lower alkyl, and
m is at least 2,
(b) a crosslinkable oxazoline compound,
(c) a crosslinkable compound capable of reacting with (a) and/or (b), wherein said crosslinkable compound capable of reacting with (a) and/or (b) is an allylically substituted hydroxy-aromatic compound having the structure:
Ar′(OH) a (—CH 2 —CH═CH 2 ) b ,
wherein:
Ar′ is optionally substituted arylene, polyarylene, heteroarylene or polyheteroarylene,
a is at least 2, and
b is at least 2, and
(d) at least one performance-modifying component.
2. The composition of claim 1 wherein X is optionally substituted alkylene.
3. The composition of claim 1 wherein X is optionally substituted cycloalkylene.
4. The composition of claim 1 wherein said crosslinkable oxazoline compound has the structure:
Z—(Ox) n
wherein:
Ox is an optionally substituted oxazoline ring,
Z is optionally substituted alkylene, cycloalkylene, arylene, polyarylene, heteroarylene or polyheteroarylene, and
n is at least 2.
5. The composition of claim 4 wherein Z is optionally substituted alkylene.
6. The composition of claim 4 wherein Z is optionally substituted cycloalkylene.
7. The composition of claim 4 wherein Z is optionally substituted arylene.
8. The composition of claim 4 wherein Z is 1,3-phenylene.
9. The composition of claim 1 wherein said performance-modifying component is selected from the group consisting of fillers, curing agents, cure retardants, cure accelerators, flexibilizers, anti-oxidants, flame retardants, fire retardants, dyes, pigments, flow modifiers, plasticizers, surfactants, strength enhancers, UV protectors, and mixtures of any two or more thereof.
10. The composition of claim 9 wherein said filler is neither thermally nor electrically conductive.
11. The composition of claim 9 wherein said filler is thermally conductive.
12. The composition of claim 11 wherein said filler is also electrically conductive.
13. The composition of claim 9 wherein said filler is electrically conductive.
14. The composition of claim 9 wherein said filler is selected from the group consisting of soft fillers, naturally occurring minerals, synthetic fused minerals, treated fillers, organic polymers, and microspheres.
15. The composition of claim 14 wherein said filler is selected from the group consisting of talc, aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, alumina, aluminum silicates, cordierite, silane-treated minerals, and polytetrafluoroethylene.
16. The composition of claim 1 wherein the weight ratio between (a) and (c) is at least about 1:20 up to about 20:1.
17. The composition of claim 1 wherein the weight ratio between (a) and (c) is at least about 1:10 up to about 10:1.
18. The composition of claim 1 wherein the weight ratio between (a) and (c) is at least about 1:5 up to about 5:1.
19. The composition of claim 1 wherein the weight ratio between (a) and (c) falls in the range of about 1:1 up to about 3:1.
20. The composition of claim 1 wherein component (b) is present in the range of about 1-10 wt %, based on the total weight of components (a) and (c), taken together.
21. The composition of claim 1 wherein component (b) is present in the range of about 3-5 wt %, based on the total weight of components (a) and (c), taken together.
22. The composition of claim 1 wherein component (d) is present in the range of about 1% up to about 200% by weight, based on the total weight of components (a), (b) and (c), taken together.
23. The composition of claim 1 , wherein component (d) comprises one or more flexibilizers, anti-oxidants, flame retardants, dyes, pigments, or surfactants.
24. A composition of comprising:
(a) a crosslinkable maleimide compound having the structure:
wherein:
X is optionally substituted alkylene, cycloalkylene, arylene, polyarylene, heteroarylene, or polyheteroarylene,
each R is independently H or optionally substituted lower alkyl, and
m is at least 2,
(b) a crosslinkable oxazoline compound,
(c) a crosslinkable compound capable of reacting with (a) and/or (b), wherein said crosslinkable compound capable of reacting with (a) and/or (b) is an allylically substituted hydroxy-aromatic compound having the structure:
Ar′(OH) a (—CH 2 —CH═CH 2 ) b ,
wherein:
Ar′ is optionally substituted bis-arylene,
a is at least 2, and
b is at least 2, and
(d) at least one performance-modifying component.
25. The composition of claim 24 wherein said bis-arylene has the structure:
—Ar″—Y′—Ar″—,
wherein:
each Ar″ is independently phenylene or substituted phenylene bearing at least one OH and at least one —CH 2 —CH═CH 2 thereon, and
Y′ is a bond, —O—, —S(O) m —, wherein m is 0, 1 or 2, or —(CR′ 2 ) x —, wherein each R′ is independently H, halogen, or optionally substituted lower alkyl, and x is 1-10.
26. The composition of claim 25 wherein each Ar″ is phenylyene, and Y′ is —(CR′ 2 ) x —, wherein each R′ is independently 11 or lower alkyl, and x is 0 or 1.
27. The composition of claim 24 wherein Ar′ is -Ph-C(CH 3 ) 2 -Ph-.
28. The composition of claim 24 wherein said allylically substituted hydroxy-aromatic compound is an allylically substituted bisphenol A.
29. The composition of claim 24 wherein said allylically substituted phenol compound is diallyl bisphenol A.
30. The composition of claim 29 wherein at least one allylic substitution on said phenol compound is at the ortho position.
31. The composition of claim 29 wherein at least one allylical substitution on said phenol compound is at the para position.
32. A composition comprising:
(a) a crosslinkable maleimide compound having the structure:
wherein:
X is optionally substituted alkylene or optionally substituted cycloalkylene,
each R is independently H or optionally substituted lower alkyl, and
m is at least 2,
(b) a crosslinkable oxazoline compound,
(c) a crosslinkable compound capable of reacting with (a) and/or (b), wherein said crosslinkable compound capable of reacting with (a) and/or (b) is an allylically substituted hydroxy-aromatic compound having the structure:
Ar′(OH) a (—CH 2 —Ch═CH 2 ) b ,
wherein:
Ar′ is optionally substituted arylene, polyarylene, heteroarylene or polyheteroarylene,
a is at least 2, and
b is at least 2, and
(d) at least one performance-modifying component, wherein component (d) comprises one or more curing agents.
33. The composition of claim 32 wherein said curing agent is an aryl phosphite.
34. The composition of claim 33 wherein said aryl phosphite is selected from the group consisting of diphenyl hydrogen phosphite (DPP); dicresyl hydrogen phosphite; phenyl p-cresyl hydrogen phosphite; phenyl m-cresyl hydrogen phosphite; dinaphthyl hydrogen phosphite; diphenyl isopropyl phosphite; diphenyl methyl phosphite, di(p-cresyl)hexyl phosphite, triphenyl phosphite (TPP), tri(m-cresyl)phosphite, diphenyl isooctyl phosphite, diphenyl 2-ethylhexyl phosphite, diphenyl isodecyl phosphite, diphenyl cyclohexyl phosphite, and 2-chloroethyl diphenyl phosphite.
35. An article comprising a partially or fully cured layer of the composition of claim 1 on a substrate.
36. The article of claim 35 wherein said substrate is a woven or non-woven organic or inorganic substrate.
37. The article of claim 36 wherein said organic substrate is a polyester, a liquid crystalline polymer (LCP), a polyphenylene sulfide (PPS), a polyphenylene oxide (PPO), a polybenzoxazoline (PBO), an Aramid, or a conductive material.
38. The article of claim 36 wherein said inorganic substrate is a woven or non-woven glass, a woven or non-woven quartz, or a conductive material.
39. The article of claim 38 wherein said conductive material is silver, nickel, gold, cobalt, copper, aluminum, graphite, silver-coated graphite, nickel-coated graphite, alloys of silver, nickel, gold, cobalt, copper and/or aluminum.
40. A prepreg produced by impregnating a porous substrate with a composition according to claim 1 , and subjecting the resulting impregnated substrate to conditions suitable to remove substantially all of the diluent therefrom.
41. The prepreg of claim 40 wherein said substrate is woven or non-woven.
42. A laminated sheet produced by layering and molding a prescribed number of sheets of the prepreg of claim 40 .
43. The laminated sheet of claim 42 further comprising one or more conductive layers.
44. The laminated sheet of claim 43 wherein said one or more conductive layers are selected from the group consisting of a metal foil, and an electrically conductive polymeric layer.
45. A printed wiring board layer produced by forming conductive patterns on the surface of the laminated sheet of claim 42 .
46. A multilayer printed wiring board produced by layering and molding a prescribed number of sheets of the patterned laminate layers of claim 45 , bonded together with one or more layers of prepreg from which the printed wiring board layer was prepared.
47. A method of making an article, said method comprising applying a composition according to claim 1 to a suitable substrate, and thereafter curing said composition.
48. A method for improving adhesion of inorganic-filled polyimide-based formulations to a substrate, said method comprising adding to a formulation according to claim 1 an amount of a bisoxazoline effective to improve the adhesion thereof to said substrate upon cure, wherein the bisoxazoline has the structure:
Z—(Ox) n
wherein:
Ox is an optionally substituted oxazoline ring,
Z is optionally substituted alkylene, cycloalkylene, arylene, polyarylene, heteroarylene or polyheteroarylene, and
n is at least 2.
49. A method of adhering inorganic-filled polyimide-based formulations to a substrate, said method comprising applying a composition according to claim 1 to a suitable substrate, and curing said composition.