IP Library Granted Patent US 7,859,889
Granted Patent B2
US 7,859,889 · App. 12/186,204 · Granted Dec 28, 2010

Semiconductor memory device

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Quick Facts
Patent No.
US 7,859,889
App. No.
12/186,204
Granted
Dec 28, 2010
Kind
B2
Abstract

In a two-transistor gain cell structure, a semiconductor memory device capable of stable reading without malfunction and having small-area memory cells is provided. In a two-transistor gain cell memory having a write transistor and a read transistor, a write word line, a read word line, a write bit line, and a read bit line are separately provided, and voltages to be applied are independently set. Furthermore, a memory cell is connected to the same read word line and write bit line as those of an adjacent memory cell.

Claims (20)

1. A semiconductor memory device comprising:

a plurality of memory cells each including a first transistor and a second transistor, a gate electrode of the first transistor being connected to a source electrode of the second transistor,

wherein two memory cells of the plurality, which are arranged adjacent to each other, have a line-symmetric shape with respect to a boundary of the two memory cells,

wherein the second transistor is a thin film transistor,

wherein a source region, a drain region, and a channel region of the first transistor are formed in a semiconductor substrate, and

wherein a source region, a drain region, and a channel region of the second transistor are formed over the semiconductor substrate, through an insulating film.

2. A semiconductor memory device according to claim 1 , wherein the source region of the second transistor is a gate electrode of the first transistor.

3. A semiconductor memory device comprising:

a plurality of memory cells each including a first transistor and a second transistor, a gate electrode of the first transistor being connected to a source electrode of the second transistor,

wherein two memory cells of the plurality, which are arranged adjacent to each other, have a line-symmetric shape with respect to a boundary of the two memory cells,

wherein drain regions of second transistors of two of the memory cells, which are adjacently arranged in a first direction, are connected to each other, and

wherein drain regions of two of the second transistors of two of the memory cells, which are adjacently arranged in a second direction perpendicular to the first direction, are separated from each other.

4. A semiconductor memory device comprising:

a plurality of memory cells each including a first transistor and a second transistor, a gate electrode of the first transistor being connected to a source electrode of the second transistor,

wherein two memory cells of the plurality, which are arranged adjacent to each other, have a line-symmetric shape with respect to a boundary of the two memory cells, and

wherein second transistors of two of the memory cells, which are adjacently arranged in a second direction, are formed between first transistors of the two memory cells.

5. A semiconductor memory device according to claim 4 ,

wherein the first transistors of the memory cells are arranged in a row in a first direction perpendicular to the second direction, and

wherein the second transistors of the memory cells are arranged in a row in the first direction.

6. A semiconductor memory device according to claim 1 , wherein a thickness of the channel region of the second transistor is no more than 5 nm.

Assignments (2)
MERGER Recorded Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRRONICS CORPORATION
Reel/Frame 024933/0869 →
CHANGE OF NAME Recorded Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0404 →