Circuit board and display device including the same
View Patent ↗One or more embodiments of the present disclosure relate to a circuit board having a substrate and a plurality of differential signal lines formed on the substrate and transmitting differential signals. The differential signal lines include a first signal line and a second signal line. The first signal line and the second signal line extend along at least two paths that are parallel to each other. The paths of the first signal line and the second signal line switch at path change portions, and the path change portions of neighboring differential signal lines are positioned at different distances away from an edge of the circuit board along the length direction of the differential signal line.
1. A circuit board comprising:
a substrate; and
a plurality of differential signal lines formed on the substrate and transmitting differential signals,
wherein the differential signal lines respectively include a first signal line and a second signal line, and
wherein the first signal line and the second signal line extend along at least two paths that are parallel to each other, and
wherein the paths of the first signal line and the second signal line switch at path change portions, and
wherein path change portions of neighboring differential signal lines are positioned at different distances away from an edge of the circuit board along the length direction of the differential signal lines.
2. The circuit board of claim 1 , wherein the substrate includes a first surface and a second surface, and
wherein the paths include a first path disposed on the first surface and a second path disposed on the second surface, and
wherein one side of the first signal line is disposed on the first path and the other side of the first signal line is disposed on the second path with respect to the path change portion, and
wherein the second signal line is disposed to avoid overlapping the first signal line outside the path change portions.
3. The circuit board of claim 2 , wherein the substrate includes a pair of via holes disposed at the path change portions, and wherein the first signal line and the second signal line are changed from the first path to the second path through the via holes.
4. The circuit board of claim 3 , wherein the first path and the second path overlap each other.
5. The circuit board of claim 4 , wherein the via holes are separated from the first path and the second path.
6. The circuit board of claim 5 , wherein the pair of via holes are separated from and opposite to the other side with reference to the first and second paths.
7. The circuit board of claim 6 , wherein the portion of the first signal line and the portion of the second signal line disposed at the path change portion form a substantially rhombic outline.
8. The circuit board of claim 1 , wherein the substrate is made of a dual-layered structure including an upper layer and a lower layer, and
wherein the path includes a first path disposed on the upper layer and a second path disposed on the lower layer, and
wherein one portion of the first signal line is disposed in the first path and the other portion of the first signal line is disposed in the second path, and
wherein the second signal line is disposed on a different path than the first signal line outside the path change portion.
9. The circuit board of claim 8 , wherein the upper layer includes a pair of via holes disposed at the path change portion, and wherein the paths of the first and second signal lines switch between the upper layer and the lower layer through the via holes.
10. The circuit board of claim 1 , wherein the substrate and the differential signal line are flexible.