Semiconductor device and method of manufacturing the same
A semiconductor device includes a substrate, a compound semiconductor layer formed over the substrate, and a protective insulating film composed of silicon nitride, which is formed over a surface of the compound semiconductor layer and whose film density in an intermediate portion is lower than that in a lower portion.
1. A semiconductor device, comprising:
a substrate;
a compound semiconductor layer formed over the substrate; and
a protective insulating film composed of silicon nitride, which is formed over a surface of the compound semiconductor layer,
wherein the protective insulating film is formed of a single-layer silicon nitride film whose film density becomes lower from a bottom to a top of the protective insulating film.
2. The semiconductor device according to claim 1 , wherein
the compound semiconductor layer is a stacked compound semiconductor layer in which a buffer layer, an electron transport layer, an electron supply layer, and a contact layer having a first opening are formed in this order,
a source electrode and a drain electrode are formed on the contact layer with being spaced from each other,
the protective insulating film is also formed on the source electrode and the drain electrode, and has a second opening overlapping the first opening between the source electrode and the drain electrode, and
a gate electrode is formed on the electron supply layer in the first opening.
3. The semiconductor device according to claim 1 , wherein
the compound semiconductor layer is a stacked compound semiconductor layer in which a buffer layer, an electron transport layer, an electron supply layer, and a contact layer having a first opening are formed in this order,
a source electrode and a drain electrode are formed on the contact layer with the first opening being interposed therebetween,
the protective insulating film is also formed on the source electrode and the drain electrode, and has a second opening on the first opening, and
a gate electrode is formed on the electron supply layer in the second opening.
4. The semiconductor device according to claim 1 , wherein
the compound semiconductor layer is a stacked compound semiconductor layer in which a buffer layer, an electron transport layer, an electron supply layer, and a surface layer are formed in this order,
a source electrode and a drain electrode are formed on the surface layer with being spaced from each other,
the protective insulating film is also formed on the source electrode and the drain electrode and has an opening between the source electrode and the drain electrode, and
a gate electrode is formed on the surface layer inside the opening.
5. The semiconductor device according to claim 1 , wherein the substrate is formed of a compound semiconductor.