IP Library Granted Patent US 7,667,967
Granted Patent B1
US 7,667,967 · App. 12/187,190 · Granted Feb 23, 2010

Liquid-cooled rack with optimized rack heat exchanger design for non-uniform power dissipation

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Quick Facts
Patent No.
US 7,667,967
App. No.
12/187,190
Granted
Feb 23, 2010
Kind
B1
Abstract

A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.

Claims (16)

1. A cooling system for a rack-mount server comprising at least one blade and a system enclosure, comprising:

a liquid cooling line;

at least one heat exchanger connected to the liquid cooling line and comprising a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections; and

a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server,

wherein the plurality of fans are divided into one or more groups corresponding to the one or more sections of the plurality of fins, and

wherein the fan density of the plurality of fans varies over the one or more groups based on the fin density of the section of the plurality of fins to which the group corresponds.

2. The cooling system of claim 1 , wherein the liquid cooling line is a tube that runs through the plurality of fins.

3. The cooling system of claim 1 , wherein the liquid cooling line comprises one or more flattened tubes disposed around the plurality of fins.

4. The cooling system of claim 1 , wherein the at least one heat exchanger is a tube-fin heat exchanger.

5. The cooling system of claim 1 , wherein relative positions within the rack-mount server of each of the sections of the plurality of fins depend on the heat dissipation characteristics of the at least one blade.

6. The cooling system of claim 1 , wherein the fin densities of each of the sections of the plurality of fins depend on the heat dissipation characteristics of the at least one blade.

7. The cooling system of claim 6 , wherein the fin density of a section of the plurality of fins corresponding to a higher power portion of the blade is higher than the fin density of a section of the plurality of fins corresponding to a lower power portion of the blade.

8. The cooling system of claim 1 , wherein the fan densities of each of the groups of the plurality of fans depend on the heat dissipation characteristics of the at least one blade.

9. The cooling system of claim 8 , wherein the fan density of a group of the plurality of fans corresponding to a higher power portion of the blade is higher than the fan density of a group of the plurality of fans corresponding to a lower power portion of the blade.

10. The cooling system of claim 1 , wherein the total cubic air flow rate of each group of the plurality of fans through the corresponding section of fins of the at least one heat exchanger is substantially constant.

11. The cooling system of claim 1 , wherein the fan density of a group of the plurality of fans corresponding to a section of higher fin density is higher than the fan density of a group of the plurality of fans corresponding to a section of lower fin density.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037305/0238 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2008
From: COPELAND, DAVID W.; VOGEL, MARLIN R.; MASTO, ANDREW R.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 021362/0155 →