Electronic device
An electronic device including: a semiconductor chip on which an integrated circuit is formed; an electrode formed on the semiconductor chip and electrically connected to the integrated circuit; a resin protrusion disposed on the semiconductor chip; an interconnect formed on the electrode and extending over the resin protrusion; a wiring board on which a wiring pattern is formed, the semiconductor chip being mounted on the wiring board so that part of the interconnect positioned over the resin protrusion faces and is electrically connected to the wiring pattern; and an adhesive that bonds the semiconductor chip and the wiring board. The resin protrusion is compressed in a direction in which the distance between the semiconductor chip and the wiring board decreases and is formed of a material having a negative coefficient of thermal expansion.
1. An electronic device comprising:
a semiconductor chip on which an integrated circuit is formed, the semiconductor chip having a rectangular shape with a pair of long sides and a pair of short sides;
an electrode formed on the semiconductor chip and electrically connected to the integrated circuit;
a resin protrusion disposed on the semiconductor chip;
an interconnect formed on the electrode and extending over the resin protrusion;
a wiring board on which a wiring pattern is formed, the semiconductor chip being mounted on the wiring board so that part of the interconnect positioned over the resin protrusion is electrically connected to the wiring pattern; and
an adhesive that bonds the semiconductor chip and the wiring board,
the electrodes being arranged along the long sides of the semiconductor chip,
the resin protrusion being formed of a resin including elastic rubber particles dispersed in a material, and
the resin protrusion having a negative coefficient of thermal expansion and the resin protrusion having a shape extending along the arrangement direction of the electrodes.
2. The electronic device as defined in claim 1 ,
the resin protrusion having a negative coefficient of thermal expansion in at least a temperature range between 25° C. and the glass transition temperature of the adhesive.
3. The electronic device as defined in claim 1 ,
the resin protrusion being formed of a mixed resin including the elastic rubber particles dispersed in a phenol novolac curing agent and a polyfunctional epoxy resin.
4. The electronic device as defined in claim 1 ,
the resin protrusion being compressed in a direction in which a distance between the semiconductor chip and the wiring board decreases.
5. The electronic device as defined in claim 1 ,
the resin protrusion being etched in areas between adjacent interconnects.
6. An electronic device comprising:
a semiconductor chip on which an integrated circuit is formed, the semiconductor chip having a rectangular shape with a pair of long sides and a pair of short sides;
an electrode formed on the semiconductor chip and electrically connected to the integrated circuit;
a resin protrusion disposed on the semiconductor chip;
an interconnect formed on the electrode and extending over the resin protrusion;
a wiring board on which a wiring pattern is formed, the semiconductor chip being mounted on the wiring board so that part of the interconnect positioned over the resin protrusion is electrically connected to the wiring pattern; and
an adhesive that bonds the semiconductor chip and the wiring board,
the electrodes being arranged along the long sides of the semiconductor chip,
the resin protrusion being formed of a resin including elastic rubber particles dispersed in a material,
the resin protrusion having a negative coefficient of thermal expansion and the resin protrusion having a shape extending along the arrangement direction of the electrodes, and
the resin protrusion having a negative coefficient of thermal expansion in at least a temperature range between 25° C. and the glass transition temperature of the adhesive.
7. An electronic device comprising:
a semiconductor chip on which an integrated circuit is formed, the semiconductor chip having a rectangular shape with a pair of long sides and a pair of short sides;
an electrode formed on the semiconductor chip and electrically connected to the integrated circuit;
a resin protrusion disposed on the semiconductor chip;
an interconnect formed on the electrode and extending over the resin protrusion;
a wiring board on which a wiring pattern is formed, the semiconductor chip being mounted on the wiring board so that part of the interconnect positioned over the resin protrusion is electrically connected to the wiring pattern; and
an adhesive that bonds the semiconductor chip and the wiring board,
the electrodes being arranged along the long sides of the semiconductor chip,
the resin protrusion being formed of a resin including elastic rubber particles dispersed in a material,
the resin protrusion having a negative coefficient of thermal expansion and the resin protrusion having a shape extending along the arrangement direction of the electrodes, and
the resin protrusion being etched in areas between adjacent interconnects.