COMPUTER COOLING SYSTEM AND METHOD
A method for providing a computer component includes providing a motherboard apart from a cooling solution such that the end user can select the motherboard and cooling solution separately, based on preferences and needs for each and connect them together after they are selected. To support this method, a motherboard includes: a support board; a chipset mounted on the support board; and a heat sink base mounted over the chipset, the heat sink base including an open, planar upper surface devoid of any cooling system working components pre-installed thereon but including a fastener aperture about the edge of the open, planar upper surface and in addition to any support board mounting connections, the fastener aperture formed to accept releasable connectors for securing the selected cooling working component.
1 . A method for providing a circuit board with a cooling solution comprising: providing a circuit board including a heat generating component and a heat sink base installed over the heat generating component; providing a cooling system working component including at least one of (i) an air cooling mechanism and (ii) a liquid cooling mechanism; and connecting the cooling system working component to the heat sink base for operation.
2 . The method of claim 1 wherein providing includes selling.
3 . The method of claim 1 wherein providing a cooling system working component includes offering the cooling system working component in packaging enabling selection by a user.
4 . The method of claim 3 wherein providing a circuit board includes packaging the circuit board for selection by the user apart from the packaging of the cooling system working component.
5 . The method of claim 3 wherein the user is selected from the group consisting of an original equipment manufacturer, a system integrator and a retail consumer.
6 . The method of claim 1 wherein providing a cooling system working component includes allowing a selection of at least one cooling mode of operation from an air cooling technology and a liquid cooling technology.
7 . The method of claim 1 wherein the heat sink base includes an open, planar upper surface with a selected mounting configuration and the cooling system working component includes a lower surface with a mounting site correspondingly positioned relative to the mounting configuration and connecting the cooling system working component includes aligning the mounting site with the mounting configuration and securing the mounting site to the mounting configuration.
8 . The method of claim 1 wherein the circuit board when provided is devoid of cooling system working components installed over the heat generating component.
9 . The method of claim 1 wherein connecting proceeds without first removing an existing cooling system working component from the heat sink base.
10 . The method of claim 1 wherein the circuit board when provided includes a pre-installed cooling system working component releasably connected on the heat sink base.
11 . The method of claim 1 wherein prior to connecting, the method further comprises removing a provided cooling system working component from the heat sink base.
12 . The method of claim 1 wherein providing a cooling system working component includes selection by a user, providing a circuit board includes selection by the user and connecting is conducted by the user.
13 . The method of claim 1 wherein connecting includes using instructions provided with at least one of the cooling system working component and the circuit board.
14 . A circuit board comprising: a support board; a heat generating component mounted on the support board; and a heat sink base mounted over the heat generating component, the heat sink base including an open, planar upper surface with an edge thereabout, support board mounting connections securing the heat sink base to the support board and a connection site about the edge of the open, planar upper surface in addition to the circuit board mounting connections, the connection site formed to accept releasable connectors.
15 . The circuit board of claim 14 devoid of any factory installed cooling system working components for the heat generating component.
16 . The circuit board of claim 14 in packaging for sale of the circuit board, the packaging containing no cooling system working components for the heat generating component.
17 . The circuit board of claim 14 in packaging for sale of the circuit board, the packaging including an instruction that a separate cooling system working component is required for the circuit board.
18 . The circuit board of claim 14 wherein the heat sink base includes an aperture on the open, planar upper surface such that a portion of the heat generating component is directly accessible therethrough.
19 . The circuit board of claim 14 further comprising: a second heat generating component; a heat sink heat conducting plate installed over the second heat generating component and a heat pipe connecting between the heat sink heat conducting plate and the heat sink base.
20 . The circuit board of claim 14 in the form of a video card.
21 . The circuit board of claim 14 in the form of a motherboard.
22 . A computer circuit board comprising: a support board; a heat generating component mounted on the support board; and a heat sink base mounted over the heat generating component, the heat sink base including an open, planar upper surface devoid of any cooling system working components installed thereon prior to sale thereof and including a mounting site adjacent the open, planar upper surface and in addition to any support board mounting connections securing the heat sink base to the support board, the mounting site formed to secure a selected cooling system working component to the heat sink base.
23 . The computer circuit board of claim 22 in packaging for sale thereof, the packaging containing no cooling system working component for the heat generating component.
24 . The computer circuit board of claim 22 in packaging for sale of the circuit board, the packaging including an instruction that the selected cooling system working component is required for use with the circuit board.
25 . The computer circuit board of claim 22 further comprising instructions and supplies for mounting the selected cooling system working component to the heat sink base.
26 . The computer circuit board of claim 22 wherein the heat sink base includes an aperture on the open, planar upper surface such that a portion of the heat generating component is directly accessible therethrough.
27 . The computer circuit board of claim 22 further comprising: a second heat generating component; a heat sink heat conducting plate installed over the second heat generating component and a heat pipe connecting between the heat sink heat conducting plate and the heat sink base.