IP Library Granted Patent US 8,145,058
Granted Patent B2
US 8,145,058 · App. 12/188,132 · Granted Mar 27, 2012

Optical network unit transceiver module having direct connect RF pin configuration

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Quick Facts
Patent No.
US 8,145,058
App. No.
12/188,132
Granted
Mar 27, 2012
Kind
B2
Abstract

Systems and method for using a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component.

Claims (45)

1. A optical network unit (ONU) transceiver module comprising:

a housing;

a printed circuit board disposed in the housing;

a laser driver disposed on the printed circuit board and configured to receive electrical signals from an external component;

a laser coupled to the laser driver and configured to transmit optical signals through an optical fiber;

an optical receiver coupled to a post amplifier and configured to convert optical signals to electrical signals;

the post amplifier, wherein the post amplifier is disposed on the printed circuit board and is configured to communicate electrical signals to the external component;

an RF interface separate from the laser driver and the post amplifier, wherein the RF interface is disposed on the printed circuit board and is configured to receive and transmit RF signals to and from the external component and convert RF signals to electrical signals and vice versa, the RF signals being different than both the electrical signals received by the laser driver and the electrical signals communicated by the post amplifier; and

a direct connect RF pin configuration comprising;

at least one ground pin;

at least one data pin spaced apart from at least one other data pin; and

means for connecting a first end of the at least one ground pin and the at least one data pin to the RF interface,

wherein a second end of the at least one ground pin and the at least one data pin extends outwardly through the housing such that the second end of each pin is available to be directly connected to the external component.

2. An ONU transceiver module according to claim 1 , wherein the RF interface is tuned to an impedance of about 50Ω or about 75Ω.

3. An ONU transceiver module according to claim 1 , wherein the RF interface has a back reflection of less than −16 dB at frequencies of about 1 GHz.

4. An ONU transceiver module according to claim 1 , wherein the RF interface has a back reflection of less than −26 dB at frequencies of about 1 GHz.

5. An ONU transceiver module according to claim 1 , wherein the RF interface has a back reflection of less than −30 dB at frequencies of about 1 GHz.

6. An ONU transceiver module according to claim 1 , wherein the RF interface has a back reflection of less than −40 dB at frequencies of about 1 GHz.

7. An ONU transceiver module according to claim 1 , wherein the means for connecting a first end of the at least one ground pin and the at least one data pin to the RF interface comprises at least one of solder, welding, conductive epoxy, conductive adhesive, and a slip fit connection.

8. An ONU transceiver module according to claim 1 , wherein the at least one ground pin has a diameter larger than the at least one data pin.

9. An optical network unit (ONU) transceiver module comprising:

a housing;

a printed circuit board disposed in the housing;

a laser driver disposed on the printed circuit board and configured to receive electrical signals from an external component;

a post amplifier disposed on the printed circuit board and configured to communicate electrical signals to the external component;

an RF interface separate from the laser driver and the post amplifier, wherein the RF interface is disposed on the printed circuit board and is configured to receive and transmit RF signals to and from the external component; and

an RF pin configuration comprising at least one ground pin and at least one data pin, each having a first end and a second end, wherein the first end of the at least one ground pin and the at least one data pin are connected to the RF interface, and a second end of the at least one ground pin and the at least one data pin are configured for connection to the external component.

10. An ONU transceiver module according to claim 9 , wherein the first end of the at least one ground pin and the at least one data pin are connected to the RF interface via at least one of the following: a solder connection, a weld connection, a connection formed of a conductive epoxy, a connection formed of a conductive adhesive, and a slip fit connection.

11. An ONU transceiver module according to claim 9 , wherein the at least one ground pin has a diameter larger than the at least one data pin.

12. An ONU transceiver module according to claim 9 , wherein the RF interface is tuned to an impedance of about 50Ω or about 75Ω.

13. An ONU transceiver module according to claim 9 , wherein the RF interface has a back reflection of less than −40 decibels (dB) at frequencies of about 1 GHz.

14. A optical network unit (ONU) transceiver module comprising:

a housing;

a printed circuit board disposed in the housing;

an optical connector configured to connect to an optical fiber;

a plurality of I/O pins configured for communicating with an external component via electrical signals;

an RF interface disposed on the printed circuit board and configured to receive and transmit RF signals to and from the external component; and

an RF pin configuration independent of the plurality of I/O pins, the RF pin configuration comprising:

at least one ground pin having a first end connected to the RF interface and a second end configured for connection to the external component; and

at least one data pin having a first end connected to the RF interface and a second end configured for connection to the external component.

15. An ONU transceiver module according to claim 14 , wherein the first end of the at least one ground pin and the at least one data pin are connected to the RF interface via at least one of the following: a solder connection, a weld connection, a connection formed of a conductive epoxy, a connection formed of a conductive adhesive, and a slip fit connection.

16. An ONU transceiver module according to claim 14 , wherein the at least one ground pin has a diameter larger than the at least one data pin.

17. An ONU transceiver module according to claim 14 , wherein the RF interface is tuned to an impedance of about 50Ω or about 75Ω.

18. An ONU transceiver module according to claim 14 , wherein the RF interface has a back reflection of less than −40 decibels (dB) at frequencies of about 1 GHz.

19. An ONU transceiver module according to claim 14 , further comprising an insulator disposed between the at least one ground pin and the at least one data pin, the insulator comprising air.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2008
From: LIU, JINXIANG; TEO, TATMING
To: FINISAR CORPORATION
Reel/Frame 021558/0781 →