IP Library Granted Patent US 7,804,687
Granted Patent B2
US 7,804,687 · App. 12/188,734 · Granted Sep 28, 2010

Liquid-cooled rack with pre-cooler and post-cooler heat exchangers used for EMI shielding

Assignee: Oracle America, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,804,687
App. No.
12/188,734
Granted
Sep 28, 2010
Kind
B2
Abstract

A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.

Claims (17)

1. A cooling system for a rack-mount server comprising:

a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server; and

a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server,

wherein the heat exchanger comprises a coolant circulation path structure and an airflow path structure in thermal contact, and

wherein the airflow path structure comprises a plurality of apertures having no dimension equal to or greater than three millimeters such that the plurality of apertures allow airflow therethrough while to shielding electromagnetic interference.

2. The cooling system of claim 1 , wherein the coolant circulation path structure comprises a tube, and the airflow path structure is arranged at an outer circumference of the tube.

3. The cooling system of claim 1 , wherein the coolant circulation path structure comprises two flattened tubes, and the airflow path structure is arranged between the two flattened tubes.

4. The cooling system of claim 1 , wherein the plurality of apertures are square-shaped.

5. The cooling system of claim 1 , wherein the plurality of apertures are circular-shaped.

6. The cooling system of claim 1 , wherein the plurality of apertures are hexagonal-shaped.

7. The cooling system of claim 6 , wherein the plurality of hexagonal-shaped apertures form a honeycomb construction.

8. The cooling system of claim 1 , further comprising a cooling line attached the heat exchanger and a pump, wherein the pump circulates coolant through the heat exchanger.

9. The cooling system of claim 8 , wherein the coolant is chilled water.

10. A heat exchanger comprising:

a coolant circulation path structure for circulating coolant; and

an airflow path structure in thermal contact with the coolant circulation path structure such that heat from air passing through the airflow path structure transfers to the coolant,

wherein the airflow path structure comprises a plurality of apertures having no dimension equal to or greater than three millimeters such that the plurality of apertures allow airflow therethrough while shielding electromagnetic interference.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037306/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2008
From: COPELAND, DAVID W.; MASTO, ANDREW R.; VOGEL, MARLIN R.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 021363/0850 →
Continuity (1)
Related Publication 20100033921A1 · Feb 11, 2010