Circuit board and electronic device using the same
A circuit board includes four positioning pads placed on a surface of the circuit board, four positioning holes corresponding to the positioning pads, respectively, and a solder mask placed on the surface around the periphery of the positioning pads. An arc-shaped recess is defined at a side of each positioning pad near the corresponding positioning hole and the space between the edges of the positioning pad and the positioning hole ranges from 0.2 mm to 0.5 mm.
1. A circuit board comprising:
a plurality of positioning pads placed on a surface of the circuit board;
a plurality of positioning hole adjacent to each positioning pads, respectively; and
a solder mask placed on the surface around periphery of the positioning pads,
wherein an arc-shaped recess is defined at a side of each positioning pad near the adjacent positioning hole and the space between the edges of the positioning pad and the positioning hole ranges from 0.2 mm to 0.5 mm.
2. The circuit board as claimed in claim 1 , wherein the space between the edges of the positioning pad and the positioning hole is 0.3 mm.
3. The circuit board as claimed in claim 1 , wherein the arc-shaped recess and the corresponding positioning hole are concentric.
4. The circuit board as claimed in claim 1 , wherein each of the positioning pads is formed on the circuit board by chemical etching.
5. The circuit board as claimed in claim 1 , wherein the solder mask is made of epoxide resin.
6. An electronic device comprising a circuit board and one or more electronic element mounted thereon, the circuit board comprising:
a plurality of positioning pads placed on a surface of the circuit board;
a plurality of positioning hole adjacent to each positioning pad; and
a solder mask placed on the surface around periphery of the positioning pads,
wherein an arc-shaped recess is defined at a side of each positioning pad near the adjacent positioning hole and the space between the edges of the positioning pad and the positioning hole ranges from 0.2 mm to 0.5 mm.
7. The electronic device as claimed in claim 6 , wherein the space between the edges of the positioning pad and the positioning hole is 0.3 mm.
8. The electronic device as claimed in claim 6 , wherein the arc-shaped recess and the corresponding positioning hole are concentric.
9. The electronic device as claimed in claim 6 , wherein each of the positioning pads is formed on the circuit board by chemical etching.
10. The electronic device as claimed in claim 6 , wherein the solder mask is made of epoxide resin.