Modem unit and mobile communication unit
View Patent ↗A modem unit includes a first semiconductor die that includes a power management unit and an embedded flash memory. A mobile communication unit includes a modem unit residing on a first semiconductor die. The first semiconductor die also includes a power management unit and an embedded flash memory.
1. A modem unit, comprising
a first semiconductor die comprising a power management unit embodied in hardware and an embedded flash memory.
2. The modem unit according to claim 1 , further comprising:
a baseband unit coupled to the power management unit.
3. The modem unit according to claim 2 , wherein the baseband unit is arranged on a second semiconductor die.
4. The modem unit according to claim 1 , wherein in the embedded flash memory one or more of calibration data, network parameters, security data and debug data are stored.
5. The modem unit according to claim 2 , further comprising:
a radio frequency unit coupled to the baseband unit.
6. The modem unit according to claim 5 , wherein the radio frequency unit is arranged on the second semiconductor die or on a third semiconductor die.
7. A mobile communication unit, comprising:
a modem unit comprising a first semiconductor die, the first semiconductor die comprising a power management unit embodied in hardware and an embedded flash memory.
8. The mobile communication unit according to claim 7 , further comprising:
an application unit coupled to the modem unit.
9. The mobile communication unit according to claim 8 , wherein the modem unit comprises a baseband unit, the baseband unit comprising a central processing unit.
10. The mobile communication unit according to claim 9 , wherein the application unit comprises a memory unit containing an operation program comprising instructions for the operation of the central processing unit.
11. The mobile communication unit according to claim 7 , wherein in the embedded flash memory one or more of calibration data, network parameters, security data and debug data are stored.
12. The mobile communication unit according to claim 9 , wherein the baseband unit is arranged on a second semiconductor die.
13. A mobile communication unit, comprising:
a modem unit comprising a baseband unit, the baseband unit comprising a central processing unit, and a first memory unit configured to store therein one or more of calibration data, network parameter, security data and debug data, wherein the modem unit resides on a first semiconductor die, and wherein a power management unit embodied in hardware and the first memory unit also resides on the first semiconductor die; and
an application unit comprising a second memory unit configured to store therein an operation program for the operation of the central processing unit.
14. The mobile communication unit according to claim 13 , wherein the first memory unit comprises a flash memory.
15. The mobile communication unit according to claim 13 , wherein the baseband unit is arranged on a second semiconductor die.
16. The mobile communication unit according to claim 15 , further comprising:
a radio frequency unit arranged on the second semiconductor die or on a third semiconductor die.
17. A mobile communication unit, comprising:
a modem unit, wherein the modem unit resides on a first semiconductor die, and wherein a power management unit embodied in hardware and an embedded flash memory also resides on the first semiconductor die; and
an application unit comprising a memory unit, wherein the memory unit is accessible by the modem unit and the application unit.
18. The mobile communication unit according to claim 17 , wherein the modem unit comprises a baseband unit, wherein the baseband unit comprises a central processing unit, wherein an operation program comprises instructions for operating the central processing unit is stored in the memory unit.
19. The mobile communication unit according to claim 17 , wherein one or more of calibration data, network parameters, security data and debug data are stored in the embedded flash memory.
20. The mobile communication unit according to claim 17 , wherein the modem unit further comprises a baseband unit arranged on a second semiconductor die.
21. A method for producing a mobile communication unit, comprising:
storing one or more of calibration data, network parameters, security data and debug data in a first memory unit;
fabricating a modem unit, wherein the modem unit comprises the first memory unit and a power management unit embodied in hardware on a first semiconductor die, and a baseband unit, and wherein the baseband unit comprises a central processing unit;
storing an operation program for the operation of the central processing unit in a second memory; and
fabricating an application unit, wherein the application unit comprises the second memory unit.
22. The method according to claim 21 , further comprising:
fabricating a second semiconductor die comprising the baseband unit.