IP Library Granted Patent US 8,142,671
Granted Patent B1
US 8,142,671 · App. 12/190,377 · Granted Mar 27, 2012

Method to fabricate a damped suspension assembly

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,142,671
App. No.
12/190,377
Granted
Mar 27, 2012
Kind
B1
Abstract

A method to fabricate a damped suspension assembly includes providing a suspension assembly including a mounting plate, a bend region, and a load beam. A first thinned area of the load beam is partially-etched. The bend region does not include the first thinned area. A constrained-layer damper is adhered to the first thinned area of the load beam without being adhered to the bend region.

Claims (20)

1. A method to fabricate a damped suspension assembly, the method comprising:

partially etching a first thinned area of a load beam;

providing a suspension assembly including the load beam, a bend region, and a mounting plate, the bend region not including the first thinned area;

adhering a constrained-layer damper to the first thinned area of the load beam without adhering the constrained-layer damper to the bend region.

2. The method of claim 1 wherein providing a suspension assembly further comprises welding the bend region to the mounting plate.

3. The method of claim 2 wherein welding comprises spot welding.

4. The method of claim 1 wherein providing a suspension assembly further comprises separately forming the bend region and forming the load beam, and welding the bend region to the load beam.

5. The method of claim 4 wherein welding comprises laser welding.

6. The method of claim 1 wherein the bend region and the load beam are formed together from the same sheet so as to be integrally joined.

7. The method of claim 1 wherein the bend region includes a second thinned area, and the constrained-layer damper is not adhered to the second thinned area.

8. The method of claim 1 wherein the load beam comprises stainless steel.

9. The method of claim 8 wherein partially etching is continued until a thickness of the first thinned area is in the range 15 microns to 80 microns.

10. The method of claim 1 wherein partially etching is continued until the load beam in the first thinned area has been etched by an amount in the range of 40% to 80% of a full thickness of the load beam.

11. The method of claim 1 wherein the constrained-layer damper includes a damping layer and a constraining layer, and adhering comprises using the damping layer as an adhesive.

12. The method of claim 11 wherein the constraining layer comprises a material selected from the group consisting of stainless steel, polyimide, and polyester.

13. The method of claim 12 wherein the constraining layer defines a constraining layer thickness in the range 10 microns to 125 microns.

14. The method of claim 11 wherein the damping layer comprises a viscoelastic material.

15. The method of claim 14 wherein the damping layer defines a damping layer thickness in the range 25 microns to 125 microns.

16. The method of claim 1 wherein the first thinned area is at least one-fifth of a total area of the load beam but no more than four-fifths of a total area of the load beam.

17. The method of claim 1 wherein partially etching comprises wet chemical etching.

Assignments (8)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2008
From: PAN, TZONG-SHII
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 021663/0129 →