Method of fabricating flexible display device
View Patent ↗A method of fabricating a flexible display device, the method including applying an adhesive layer including polyimide on a carrier substrate, laminating a flexible substrate on the adhesive layer, and separating the carrier substrate from the flexible substrate by irradiating a laser beam or light onto the adhesive layer.
1. A method of fabricating a flexible display device, comprising:
applying an adhesive layer including polyimide to a surface of a carrier substrate;
placing a flexible substrate on the adhesive layer;
forming a thin film transistor array on the flexible substrate; and
separating the carrier substrate from the flexible substrate by irradiating a laser beam or light onto the adhesive layer.
2. The method according to claim 1 , further comprising:
forming a display layer on the flexible substrate on which the thin film transistor array is formed after forming a thin film transistor array on the flexible substrate;
placing an opposite substrate on the display layer; and
mounting a driving circuit on the display layer to drive the display layer.
3. The method according to claim 1 , wherein the adhesive layer is comprised of a mixture of the polyimide and a coupler.
4. The method according to claim 1 , wherein the adhesive layer comprises:
a polyimide layer including the polyimide; and
coupler layers which include a coupler and are formed at upper and lower surfaces of the polyimide layer.
5. The method according to claim 1 , further comprising:
heating the adhesive layer to a first temperature for a first amount of time after placing the adhesive layer on the surface of the carrier substrate; and
heating the adhesive layer to a second temperature that is higher than the first temperature for a second amount of time after placing the flexible substrate on the adhesive layer.
6. The method according to claim 1 , wherein a surface of the flexible substrate is processed by plasma or oxygen.
7. The method according to claim 1 , wherein the flexible substrate is comprised of a polymer material selected from a group consisting of polyether sulphone, polyethylene naphthelate, fiber reinforced plastic, and polyacrylate.
8. The method according to claim 1 , wherein separating the carrier substrate from the flexible substrate is implemented by irradiating an excimer laser beam onto the adhesive layer.
9. The method according to claim 1 , wherein the polyimide has a glass transition temperature of 350° C. or greater.
10. The method according to claim 1 , wherein placing the flexible substrate comprises laminating the flexible substrate on the adhesive layer.
11. The method according to claim 1 , wherein the adhesive layer made of an adhesive hardening agent having a glass transition temperature of 350° C. or greater on a carrier substrate.
12. A method of fabricating a flexible display device, comprising:
applying an adhesive layer including polyimide to a surface of a carrier substrate;
placing a flexible substrate on the adhesive layer;
forming a color filter array on the flexible substrate; and
separating the carrier substrate from the flexible substrate by irradiating a laser beam or light onto the adhesive layer.
13. The method according to claim 12 , further comprising:
placing a display layer on the flexible substrate on which the color filter array is formed after forming a color filter array on the flexible substrate; and
placing an opposite substrate on the display layer.
14. The method according to claim 12 , wherein the adhesive layer is comprised of a mixture of the polyimide and a coupler.
15. The method according to claim 12 , wherein the adhesive layer comprises:
a polyimide layer including the polyimide; and
coupler layers which include a coupler and are formed at upper and lower surfaces of the polyimide layer.
16. The method according to claim 12 , further comprising:
heating the adhesive layer to a first temperature for a first amount of time after placing the adhesive layer on the surface of the carrier substrate; and
heating the adhesive layer to a second temperature that is higher than the first temperature for a second amount of time after placing the flexible substrate on the adhesive layer.
17. The method according to claim 12 , wherein a surface of the flexible substrate is processed by plasma or oxygen.
18. The method according to claim 12 , wherein the flexible substrate is comprised of a polymer material selected from a group consisting of, polyether sulphone, polyethylene naphthelate, fiber reinforced plastic, and polyacrylate.
19. The method according to claim 12 , wherein separating the carrier substrate from the flexible substrate is implemented by irradiating an excimer laser beam onto the adhesive layer.
20. The method according to claim 12 , wherein the polyimide has a glass transition temperature of 350° C. or greater.
21. The method according to claim 12 , wherein placing the flexible substrate comprises laminating the flexible substrate on the adhesive layer.