Display device with chiplets
View Patent ↗A display device includes: a substrate; one or more pixels arranged on the substrate, each pixel including a control electrode; a wiring layer located over the substrate, the wiring layer having a continuous line and a discontinuous pass-thru line formed therein. The active-matrix device includes at least one chiplet located over the substrate and including first, second, third, and control connection pads including; a control line electrically connecting the control connection pad to the control electrode; a first end of the discontinuous pass-thru line connected to the first connection pad and a second end of the discontinuous pass-thru line connected to the second connection pad; circuitry electrically connecting the first and second connection pads; and the continuous line electrically connected to the third connection pad, wherein the continuous line extends to opposite sides of the chiplet.
1. A display device, comprising:
a substrate;
one or more pixels arranged on the substrate, each pixel including a control electrode;
a wiring layer located over the substrate, the wiring layer having a continuous line and a discontinuous pass-thru line formed therein; and
at least one chiplet located over the substrate and including first, second, third, and control connection pads including:
a control line electrically connecting the control connection pad to the control electrode;
a first end of the discontinuous pass-thru line connected to the first connection pad and a second end of the discontinuous pass-thru line connected to the second connection pad;
circuitry electrically connecting the first and second connection pads; and
the continuous line electrically connected to the third connection pad, wherein the continuous line extends to opposite sides of the chiplet and wherein the at least one chiplet has a rectangular shape having two opposing short sides and two opposing long sides.
2. The active-matrix device of claim 1 , wherein the size of the chiplet is limited by the size and number of the connection pads.
3. The active-matrix device of claim 1 , further comprising bus lines for signal and power distribution and wherein all of the bus lines are formed within the wiring layer.
4. The active-matrix device of claim 1 , wherein the chiplet has a thickness of less than 20 microns.
5. The active-matrix device of claim 1 , wherein the pass-thru lines are aligned with the long dimension of the chiplet.
6. The active-matrix device of claim 1 , wherein the chiplet is oriented over the substrate so that the first connection pad is as close as, or closer than, any other connection pad to one of the short sides and the second connection pad is as close as or closer than any other connection pad to the other of the short sides.
7. The active-matrix device of claim 1 , wherein the chiplet is oriented over the substrate so that the continuous lines are aligned with the short dimension of the chiplet.
8. The active-matrix device of claim 1 , wherein the chiplet is oriented over the substrate so that the third connection pad is closer to the center of the chiplet than to the short sides, the third connection pad is at the center of the chiplet in either the short or long dimensions, or the third connection pad is at the center of the chiplet in both the short and long dimensions.
9. The active-matrix device of claim 1 , wherein the number of pass-thru lines is less than or equal to the number of continuous lines.
10. The active-matrix device of claim 1 , wherein the chiplet has only two connection pads in the short dimension forming two rows of connection pads in the long dimension.
11. The active-matrix device of claim 1 , wherein the chiplet has only one connection pad in the short dimension forming one row of connection pads in the long dimension.
12. The active-matrix device of claim 1 , wherein the pass-thru line is orthogonal to the continuous line.
13. The active-matrix device of claim 1 , wherein the chiplet is located between the wiring layer and the substrate.
14. The active-matrix device of claim 1 , wherein the wiring layer is located between the chiplet and the substrate.
15. The active-matrix device of claim 1 , wherein the control connection pad is between the first and third connection pads or between the second and third connection pads.
16. The active-matrix device of claim 1 , wherein one of the continuous lines is a power line.
17. The active-matrix device of claim 1 , wherein the continuous line carries a data signal and the pass-thru line carries a select signal or wherein the continuous lines carries a select signal and the pass-thru lines carries a data signal.
18. The active-matrix device of claim 1 , wherein the pixels comprise organic or inorganic light-emitting diodes, light-sensitive diodes, or light-sensitive transistors.
19. The active-matrix device of claim 1 , wherein the control electrodes are in the wiring layer.
20. The active-matrix device of claim 1 , wherein the control electrodes are in a different layer than the wiring layer.
21. The active-matrix device of claim 1 , wherein the chiplet is oriented over the substrate so that the first connection pad is closer than any other connection pad to one of the short sides and the second connection pad is closer than any other connection pad to the other of the short sides.