Optical device and method for fabricating the same
View Patent ↗An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.
1. A method for fabricating an optical device, comprising steps in an order of:
(a) of molding a lead frame with a wiring pattern to form a molded structure of bases with a plurality of optical device formation regions each surrounded by respective opening;
(b) attaching, after the step (a), an optical element chip to each of the optical device formation regions so that the chip partially covers the opening, the optical device formation regions being located in the molded structure of the bases or in individual separated parts made by splitting the molded structure;
(c) partially sealing, after the step (b), the optical element chips and connecting portions of the molded structure or of the separated parts of the molded structure respectively with a first resin member;
(d) attaching, translucent members to the molded structure or the separated parts of the molded structure respectively so that each of the translucent members faces the corresponding optical element chip with the opening interposed therebetween; and
(e) sealing, the translucent members and the molded structure of the bases or the separated parts with a second resin member,
wherein in the step (a), a resin sealing is carried out with an internal terminal portion of the wiring pattern put on a projection of a lower die of molding dies and thereby sandwiched by an upper die and the lower die.
2. The method of claim 1 ,
wherein the optical element chip is flip-chip bonded to portions of the wiring pattern.
3. The method of claim 1 , further comprising the step of attaching, after the step (b), an integrated circuit chip to the back surface of each of the optical element chips,
wherein in the step (c), the first resin member seals the optical element chips, the integrated circuit chips, and the connecting portions of the molded structure or of the separated parts of the molded structure.
4. The method of claim 1 ,
wherein in the step (a), resin molding is carried out with the lead frame with the wiring pattern placed on a sealing tape and installed in a molding die.