Semiconductor device
View Patent ↗In a semiconductor device including an n-type metal oxide semiconductor transistor for electrostatic discharge protection surrounded by a shallow trench for device isolation, in order to suppress the off-leak current in an off state, there is formed, in the vicinity of the drain region of the NMOS transistor for ESD protection, an n-type region receiving a signal from an external connection terminal via a p-type region in contact with the drain region of the NMOS transistor for ESD protection.
1. A semiconductor device, comprising:
an n-type metal oxide semiconductor transistor for electrostatic discharge protection disposed on a semiconductor substrate, placed between an external connection terminal and an internal circuit region so that an internal element disposed in the internal circuit region is protected from electrostatic discharge breakdown;
a p-type region disposed on the semiconductor substrate in contact with a side of a drain region of the n-type metal oxide semiconductor transistor that is opposite to a gate electrode of the n-type metal oxide semiconductor transistor, the drain region is between the gate electrode and the p-type region;
an n-type region placed apart from the drain region opposite to the gate electrode of the n-type metal oxide semiconductor transistor, fully isolated from the drain region by the p-type region, having no connection to the drain region through another n-type region, and configured to receive a signal from the external connection terminal; and
a shallow trench region surrounding the n-type metal oxide semiconductor transistor, the p-type region, and the n-type region for isolation.
2. A semiconductor device according to claim 1 , wherein the p-type region has such a width that allows conduction initiated by punch-through between the n-type region and the drain region when a voltage higher than a power supply voltage of the semiconductor device is applied to the n-type region.
3. A semiconductor device according to claim 1 , wherein the n-type region is wholly enclosed by the p-type region.
4. A semiconductor device according to claim 1 , wherein a plurality of the n-type metal oxide semiconductor transistors for electrostatic discharge protection are symmetrically disposed against the n-type region being a center.
5. A semiconductor device according to claim 1 , wherein the n-type metal oxide semiconductor transistor for electrostatic discharge protection is an n-type metal oxide semiconductor having a lightly doped drain structure.
6. A semiconductor device according to claim 1 , wherein the n-type metal oxide semiconductor transistor for electrostatic discharge protection is an n-type metal oxide semiconductor transistor having an offset drain structure.
7. A semiconductor device, comprising:
a first and a second n-type metal oxide semiconductor transistor for electrostatic discharge protection disposed on a semiconductor substrate;
a first p-type region disposed on the semiconductor substrate in contact with a side of a drain region of the first n-type metal oxide semiconductor transistor that is opposite to a gate electrode of the first n-type metal oxide semiconductor transistor;
a second p-type region disposed on the semiconductor substrate in contact with a side of a drain region of the second n-type metal oxide semiconductor transistor that is opposite to a gate electrode of the second n-type metal oxide semiconductor transistor; and
an n-type region between the first and second p-type regions, fully isolated from the drain regions of each of the first and second n-type regions of each of the first and second n-type metal oxide semiconductor transistors, and having no connection to the drain regions through another n-type region, and configured to receive a signal from the external connection terminal.
8. The semiconductor device of claim 7 , further comprising a shallow trench region surrounding the first and second n-type metal oxide semiconductor transistors, the first and second p-type regions, and the n-type region for isolation.